PIC18LF252-I/SO Microchip Technology, PIC18LF252-I/SO Datasheet - Page 12

• Manufacturer Part Number: PIC18LF252-I/SO
• Description: IC MCU FLASH 16KX16 A/D 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18LF252-I/SO

• Core Size: 8-Bit
• Program Memory Size: 32KB (16K x 16)
• Core Processor: PIC
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 23
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 1.5K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Controller Family/series: PIC18
• No. Of I/o's: 23
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 1.5KB
• Cpu Speed: 40MHz
• No. Of Timers: 4
• Processor Series: PIC18LF
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 1.5 KB
• Interface Type: MSSP, SPI, I2C, PSP, USART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 23
• Number Of Timers: 4 bit
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163022, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 5 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

PIC18FXX2
REVISION HISTORY
Rev A Document (4/2002)
First revision of this document, silicon issues 1 (Pro-
gram Memory) and 2 (Data EEPROM) and data sheet
issues 1 (Interrupts), 2 and 3 (USART) and 4 (Program
Memory).
Rev B Document (7/2002)
Added silicon issues 3 and 4 (Interrupts and Core -
Program Memory Space).
Rev C Document (10/2002)
All data sheet issues were removed. Added silicon
issues 5, 6 and 7 (Core - Program Memory Space and
Data EEPROM).
Rev D Document (1/2003)
Updated date code information for silicon issues 5 and
6 (Core - Program Memory Space), and added data
sheet issue 1 (DC Characteristics). Rev. B4 Silicon was
included along with Rev. B3 Silicon in this document
revision.
Rev E Document (3/2003)
Updated silicon issue 6 (Core - Program Memory
Space). Added silicon issues 8, 9 and 10 (MSSP and
Core - Instruction Set) and data sheet clarification 2
(Packaging - Pinout and Product Identification).
Rev F Document (7/2003)
Added silicon issue 11 (Timer1 Oscillator).
Rev G Document (05/2005)
Added silicon issue 12 (Reset).
© 2005 Microchip Technology Inc.
DS80127G-page 12