PIC18LF252-I/SP Microchip Technology, PIC18LF252-I/SP Datasheet - Page 10

IC MCU FLASH 16KX16 A/D 28DIP

PIC18LF252-I/SP

Manufacturer Part Number
PIC18LF252-I/SP
Description
IC MCU FLASH 16KX16 A/D 28DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18LF252-I/SP

Program Memory Type
FLASH
Program Memory Size
32KB (16K x 16)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
23
Eeprom Size
256 x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1.5 KB
Interface Type
MSSP, SPI, I2C, PSP, USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
23
Number Of Timers
1 x 16 bit
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163022, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
5 bit
Package
28SPDIP
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Operating Supply Voltage
2.5|3.3|5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18LF252-I/SP
Manufacturer:
MICROCHIPS
Quantity:
5 510
Part Number:
PIC18LF252-I/SP
Manufacturer:
XILINK
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Part Number:
PIC18LF252-I/SP
Manufacturer:
MICROCHIP
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1 653
PIC18FXX2/XX8
3.2
Programming code memory is accomplished by first
loading data into the appropriate write buffers and then
initiating a programming sequence. Each panel in the
code memory space (see Figure 2-2) has an 8-byte
deep write buffer that must be loaded prior to initiating
a write sequence. The actual memory write sequence
takes the contents of these buffers and programs the
associated EEPROM code memory.
Typically, all of the program buffers are written in paral-
lel (Multi-Panel Write mode). In other words, in the case
of a 32-Kbyte device (4 panels with an 8-byte buffer per
panel), 32 bytes will be simultaneously programmed
during each programming sequence. In this case, the
offset of the write within each panel is the same (see
Figure 3-4). Multi-Panel Write mode is enabled by
appropriately configuring the programming control
register located at 3C0006h.
DS39576C-page 10
Code Memory Programming
The programming duration is externally timed and is
controlled by SCLK. After a “Start Programming” com-
mand is issued (4-bit command, ‘1111’), a NOP is
issued, where the 4th SCLK is held high for the
duration of the programming time, P9.
After SCLK is brought low, the programming sequence
is terminated. SCLK must be held low for the time spec-
ified by parameter P10 to allow high voltage discharge
of the memory array.
The code sequence to program a PIC18FXX2/XX8
device is shown in Figure 3-4. The flowchart shown in
Figure 3-5 depicts the logic necessary to completely
write a PIC18FXX2/XX8 device.
Note:
The TBLPTR register must contain the
same offset value when initiating the pro-
gramming sequence as it did when the
write buffers were loaded.
 2010 Microchip Technology Inc.

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