PIC16F876-20I/SO Microchip Technology, PIC16F876-20I/SO Datasheet - Page 109
![IC MCU FLASH 8KX14 EE 28SOIC](/photos/6/59/65909/150-28-soic_sml.jpg)
PIC16F876-20I/SO
Manufacturer Part Number
PIC16F876-20I/SO
Description
IC MCU FLASH 8KX14 EE 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16C770-ISO.pdf
(8 pages)
4.PIC16F873-04SO.pdf
(218 pages)
5.PIC16F873-04SO.pdf
(5 pages)
6.PIC16F873-04SO.pdf
(5 pages)
Specifications of PIC16F876-20I/SO
Core Size
8-Bit
Program Memory Size
14KB (8K x 14)
Core Processor
PIC
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Controller Family/series
PIC16F
No. Of I/o's
22
Eeprom Memory Size
256Byte
Ram Memory Size
368Byte
Cpu Speed
20MHz
No. Of Timers
3
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
MSSP, PSP, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 5 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL309-1073 - ADAPTER 28-SOIC TO 28-SOIC309-1024 - ADAPTER 28-SOIC TO 28-DIP309-1023 - ADAPTER 28-SOIC TO 28-DIP
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F876-20I/SO
Manufacturer:
TEMIC
Quantity:
1 383
Part Number:
PIC16F876-20I/SO
Manufacturer:
MIC
Quantity:
20 000
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16C770-ISO PDF datasheet #3
- PIC16F873-04SO PDF datasheet #4
- PIC16F873-04SO PDF datasheet #5
- PIC16F873-04SO PDF datasheet #6
- Current page: 109 of 688
- Download datasheet (3Mb)
1997 Microchip Technology Inc.
Example 6-4: RAM Initialization
Bank0_LP
;
; Next Bank (Bank1)
; (** ONLY REQUIRED IF DEVICE HAS A BANK1 **)
;
Bank1_LP
;
; Next Bank (Bank2)
; (** ONLY REQUIRED IF DEVICE HAS A BANK2 **)
;
Bank2_LP
;
; Next Bank (Bank3)
; (** ONLY REQUIRED IF DEVICE HAS A BANK3 **)
;
Bank3_LP
:
CLRF
MOVLW
MOVWF
CLRF
INCF
BTFSS
GOTO
MOVLW
MOVWF
CLRF
INCF
BTFSS
GOTO
BSF
MOVLW
MOVWF
CLRF
INCF
BTFSS
GOTO
MOVLW
MOVWF
CLRF
INCF
BTFSS
GOTO
Section 6. Memory Organization
STATUS
0x20
FSR
INDF0
FSR
FSR, 7
Bank0_LP
0xA0
FSR
INDF0
FSR
STATUS, C
Bank1_LP
STATUS, IRP
0x20
FSR
INDF0
FSR
FSR, 7
Bank2_LP
0xA0
FSR
INDF0
FSR
STATUS, C
Bank3_LP
; Clear STATUS register (Bank0)
; 1st address (in bank) of GPR area
; Move it to Indirect address register
; Clear GPR at address pointed to by FSR
; Next GPR (RAM) address
; End of current bank ? (FSR = 80h, C = 0)
; NO, clear next location
; 1st address (in bank) of GPR area
; Move it to Indirect address register
; Clear GPR at address pointed to by FSR
; Next GPR (RAM) address
; End of current bank? (FSR = 00h, C = 1)
; NO, clear next location
; Select Bank2 and Bank3
;
; 1st address (in bank) of GPR area
; Move it to Indirect address register
; Clear GPR at address pointed to by FSR
; Next GPR (RAM) address
; End of current bank? (FSR = 80h, C = 0)
; NO, clear next location
; 1st address (in bank) of GPR area
; Move it to Indirect address register
; Clear GPR at address pointed to by FSR
; Next GPR (RAM) address
; End of current bank? (FSR = 00h, C = 1)
; NO, clear next location
; YES, All GPRs (RAM) is cleared
for Indirect addressing
DS31006A-page 6-15
6
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