PIC24FJ256GB110-I/PT Microchip Technology, PIC24FJ256GB110-I/PT Datasheet - Page 30
![IC PIC MCU FLASH 256K 100TQFP](/photos/12/13/121330/c04-100-tqfp_sml.jpg)
PIC24FJ256GB110-I/PT
Manufacturer Part Number
PIC24FJ256GB110-I/PT
Description
IC PIC MCU FLASH 256K 100TQFP
Manufacturer
Microchip Technology
Series
PIC® 24Fr
Datasheets
1.PIC24FJ128GA106-IPT.pdf
(52 pages)
2.PIC24FJ64GB106-IPT.pdf
(16 pages)
3.PIC24FJ64GB106-IPT.pdf
(352 pages)
4.PIC24FJ192GB108-IPT.pdf
(328 pages)
Specifications of PIC24FJ256GB110-I/PT
Program Memory Type
FLASH
Program Memory Size
256KB (85.5K x 24)
Package / Case
100-TFQFP
Core Processor
PIC
Core Size
16-Bit
Speed
32MHz
Connectivity
I²C, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
83
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC24FJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
16 KB
Interface Type
I2C/SPI/UART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
84
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DM240011
Minimum Operating Temperature
- 40 C
On-chip Adc
16-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1004 - PIC24 BREAKOUT BOARDDM240011 - KIT STARTER MPLAB FOR PIC24F MCUMA240014 - MODULE PLUG-IN PIC24DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
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Quantity
Price
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- PIC24FJ128GA106-IPT PDF datasheet
- PIC24FJ64GB106-IPT PDF datasheet #2
- PIC24FJ64GB106-IPT PDF datasheet #3
- PIC24FJ192GB108-IPT PDF datasheet #4
- Current page: 30 of 352
- Download datasheet (3Mb)
PIC24FJ256GB110 FAMILY
2.6
Many microcontrollers have options for at least two
oscillators: a high-frequency primary oscillator and a
low-frequency
Section 8.0 “Oscillator Configuration” for details).
The oscillator circuit should be placed on the same
side of the board as the device. Place the oscillator
circuit close to the respective oscillator pins with no
more than 0.5 inch (12 mm) between the circuit
components and the pins. The load capacitors should
be placed next to the oscillator itself, on the same side
of the board.
Use a grounded copper pour around the oscillator cir-
cuit to isolate it from surrounding circuits. The
grounded copper pour should be routed directly to the
MCU ground. Do not run any signal traces or power
traces inside the ground pour. Also, if using a two-sided
board, avoid any traces on the other side of the board
where the crystal is placed.
Layout suggestions are shown in Figure 2-4. In-line
packages may be handled with a single-sided layout
that completely encompasses the oscillator pins. With
fine-pitch packages, it is not always possible to com-
pletely surround the pins and components. A suitable
solution is to tie the broken guard sections to a mirrored
ground layer. In all cases, the guard trace(s) must be
returned to ground.
In planning the application’s routing and I/O assign-
ments, ensure that adjacent port pins and other signals
in close proximity to the oscillator are benign (i.e., free
of high frequencies, short rise and fall times and other
similar noise).
For additional information and design guidance on
oscillator circuits, please refer to these Microchip
Application Notes, available at the corporate web site
(www.microchip.com):
• AN826, “Crystal Oscillator Basics and Crystal
• AN849, “Basic PICmicro
• AN943, “Practical PICmicro
• AN949, “Making Your Oscillator Work”
DS39897C-page 30
Selection for rfPIC™ and PICmicro
and Design”
External Oscillator Pins
secondary
®
Oscillator Design”
®
oscillator
Oscillator Analysis
®
Devices”
(refer
to
FIGURE 2-4:
(tied to ground)
Bottom Layer
Copper Pour
Oscillator
Secondary
Primary
Oscillator
Crystal
GND
OSCO
OSCI
C1
C2
Sec Oscillator: C1
DEVICE PINS
(tied to ground)
Single-Sided and In-line Layouts:
Copper Pour
Fine-Pitch (Dual-Sided) Layouts:
`
`
SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
Top Layer Copper Pour
(tied to ground)
2009 Microchip Technology Inc.
`
Primary Oscillator
Sec Oscillator: C2
Crystal
DEVICE PINS
C2
C1
Oscillator
OSCI
OSCO
GND
SOSCO
SOSC I
Crystal
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