DSPIC33FJ128GP710-I/PT Microchip Technology, DSPIC33FJ128GP710-I/PT Datasheet - Page 14
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DSPIC33FJ128GP710-I/PT
Manufacturer Part Number
DSPIC33FJ128GP710-I/PT
Description
IC DSPIC MCU/DSP 128K 100TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ12GP201-ISO.pdf
(90 pages)
2.DSPIC33FJ64GP206-IPT.pdf
(322 pages)
3.DSPIC33FJ64GP206-IPT.pdf
(28 pages)
4.DSPIC33FJ128MC506-IPT.pdf
(24 pages)
Specifications of DSPIC33FJ128GP710-I/PT
Program Memory Type
FLASH
Program Memory Size
128KB (128K x 8)
Package / Case
100-TFQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
85
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 32x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
85
Data Ram Size
16 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1001 - DSPIC33 BREAKOUT BOARDAC164333 - MODULE SKT FOR PM3 100QFPDM300024 - KIT DEMO DSPICDEM 1.1DV164033 - KIT START EXPLORER 16 MPLAB ICD2MA330012 - MODULE DSPIC33 100P TO 84QFPMA330011 - MODULE DSPIC33 100P TO 100QFPDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32DV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ128GP710-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
26. Module: Interrupt Controller
DS80446D-page 14
If a clock failure occurs when the device is in Idle
mode, the oscillator failure trap does not vector to
the Trap Service Routine. Instead, the device will
simply wake-up from Idle mode and continue code
execution if the Fail-Safe Clock Monitor (FSCM) is
enabled.
Work around
Whenever the device wakes up from Idle
(assuming the FSCM is enabled) the user software
should check the state of the OSCFAIL bit
(INTCON1<1>) to determine whether a clock
failure occurred, and then perform the appropriate
clock switch operation. Regardless, the Trap
Service Routine must be included in the user
application.
Affected Silicon Revisions
A2
X
A3
X
A4
X
27. Module: Internal Voltage Regulator
28. Module: ECAN
If a MCLR Reset pulse causes the device to wake-
up from Sleep mode, the device wakes up without
waiting for the on-chip voltage regulator to power-
up. This will subsequently result in a Brown-out
Reset (BOR).
Work around
None.
Affected Silicon Revisions
The C1RXOVF2 and C2RXOVF2 registers are
non-functional. They are always read back as
0x0000, even when a receive overflow has
occurred.
Work around
None.
Affected Silicon Revisions
A2
A2
X
X
A3
A3
X
X
A4
A4
X
X
© 2010 Microchip Technology Inc.