DSPIC33FJ64GS610-I/PT Microchip Technology, DSPIC33FJ64GS610-I/PT Datasheet - Page 384
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DSPIC33FJ64GS610-I/PT
Manufacturer Part Number
DSPIC33FJ64GS610-I/PT
Description
IC MCU/DSP 64KB FLASH 100TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Specifications of DSPIC33FJ64GS610-I/PT
Program Memory Type
FLASH
Program Memory Size
64KB (64K x 8)
Package / Case
100-TFQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, QEI, POR, PWM, WDT
Number Of I /o
85
Ram Size
9K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 24x10b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Numeric And Arithmetic Format
Fixed-Point or Floating-Point
Instruction Set Architecture
Harvard
Device Million Instructions Per Second
40 MIPs
Maximum Clock Frequency
120 MHz
Number Of Programmable I/os
85
Data Ram Size
4 KB
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
Interface Type
I2C, SPI, UART
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 24 Channel
On-chip Dac
10 bit, 4 Channel
Core Frequency
40MHz
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
85
Flash Memory Size
64KB
Supply Voltage Range
3V To 3.6V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
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dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
TABLE 27-38: COMPARATOR MODULE SPECIFICATIONS
TABLE 27-39: DAC MODULE SPECIFICATIONS
DS70591C-page 384
AC and DC CHARACTERISTICS
CM10
CM11
CM12
CM13
CM14
Note 1:
AC and DC CHARACTERISTICS
DA03
DA04
DA05
DA06
DA07
Note 1:
Param.
Param.
DA01
DA02
No.
No.
V
V
V
CMRR
T
INL
DNL
EOFF
EG
Symbol Characteristic
Symbol Characteristic
CV
CV
T
RESP
IOFF
ICM
GAIN
Parameters are for design guidance only and are not tested in manufacturing.
Parameters are for design guidance only and are not tested in manufacturing.
SET
RSRC
RES
Input Offset Voltage
Input Common Mode
Voltage Range
Open Loop Gain
Common Mode
Rejection Ratio
Large Signal Response
External Reference Voltage
Resolution
Integral Nonlinearity Error
Differential Nonlinearity Error
Offset Error
Gain Error
Settling Time
(1)
(1)
(1)
(1)
Standard Operating Conditions (unless otherwise stated)
Operating temperature: -40°C T
Min
(1)
90
70
0
Preliminary
Standard Operating Conditions (unless otherwise stated)
Operating temperature: -40°C T
Typ
Min
±5
20
—
—
—
—
—
—
—
0
AV
10 data bits
±1.0
±0.8
±2.0
±2.0
DD
Typ
Max
±15
30
—
—
– 1.5
AV
-40°C T
Units
DD
Max
650
mV
db
db
ns
—
—
—
—
V
-40°C T
– 1.6
A
V+ input step of 100 mv while
V- input held at AV
measured from analog input pin to
PWM output pin.
A
+125°C for Extended
+85°C for Industrial
Units
nsec
LSB
LSB
LSB
bits
—
A
V
A
2010 Microchip Technology Inc.
+125°C for Extended
+85°C for Industrial
AV
DAC
Measured when
range = 1 (high range),
and CMREF<9:0> transi-
tions from 0x1FF to
0x300.
Comments
DD
REF
= 3.3V,
Comments
DD
= (AV
/2. Delay
DD
/2)V
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