DSPIC33FJ256GP510-I/PF Microchip Technology, DSPIC33FJ256GP510-I/PF Datasheet - Page 82

IC DSPIC MCU/DSP 256K 100TQFP

DSPIC33FJ256GP510-I/PF

Manufacturer Part Number
DSPIC33FJ256GP510-I/PF
Description
IC DSPIC MCU/DSP 256K 100TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr

Specifications of DSPIC33FJ256GP510-I/PF

Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
85
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 32x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Core Frequency
40MHz
Core Supply Voltage
3.3V
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
85
Flash Memory Size
256KB
Supply Voltage Range
3V To 3.6V
Package
100TQFP
Device Core
dsPIC
Family Name
dSPIC33
Maximum Speed
40 MHz
Operating Supply Voltage
3.3 V
Data Bus Width
16 Bit
Number Of Programmable I/os
85
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
32-chx10-bit|32-chx12-bit
Number Of Timers
9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1001 - DSPIC33 BREAKOUT BOARDDM300024 - KIT DEMO DSPICDEM 1.1DV164033 - KIT START EXPLORER 16 MPLAB ICD2MA330012 - MODULE DSPIC33 100P TO 84QFPMA330011 - MODULE DSPIC33 100P TO 100QFPDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164323 - MODULE SKT FOR 100TQFP
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC33FJ256GP510-I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
Revision H (October 2010)
This revision includes the following updates:
• Text and formatting updates have been
• All references to V
• All occurrences of PGC and PGD have been
• Added topics covered in
• Moved the Checksum Computation table to the
• Updated all occurrences of TBLPG to TBLPAG
• Removed the ERASEB command from the
• Updated the High-Level Enhanced ICSP™
• Replaced the Device Configuration Register Map
• Updated the Note in
• Changed Opcode 0x7 to Reserved in the
• Removed 4.2.10 “ERASEB Command”
• Updated the table cross-references in
• Combined all Default Configuration Register
• Relocated the paragraph on ICSP programming
• Added a Note to
• Updated Step 4 in Programming the Programming
• Updated Device IDs and Revision IDs (see
• Updated parameters D111, P1, P1A and P1B in
• Added Checksum Computation Example When
DS70152H-page 82
incorporated throughout the document
changed to: V
changed to PGCx and PGDx, respectively
Overview”
appendix (see
throughout the document
Command Set Summary (see
Programming Flow (see
(previously Table 4-3) with individual tables for
each dsPIC33F/PIC24H device family (see
Table 3-3
“Programming Methodology”
Programming Executive Command Set (see
Table
Section 5.7 “Writing Configuration Memory”
Values tables into one table (see
details, which now appears just before
Executive (see
Table
the AC/DC Characteristics and Timing
Requirements (see
Using CodeGuard™ Security (see
4-1)
7-1)
through
CAP
Table
Table
Section 6.1 “Overview”
Table
CAP
Table
Section 3.6.2
D-1)
6-1)
/V
DDCORE
3-12)
Figure
Section 1.0 “Device
8-1)
Table
3-1)
have been
Table
Table
3-1)
Table 5-7
5-6)
D-2).
© 2010 Microchip Technology Inc.

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