DSPIC33FJ256GP510A-I/PF Microchip Technology, DSPIC33FJ256GP510A-I/PF Datasheet - Page 323

• Manufacturer Part Number: DSPIC33FJ256GP510A-I/PF
• Description: IC MCU 16BIT 256KB FLASH 100TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ256GP510A-I/PF

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 85
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 32x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP
• Core Frequency: 40MHz
• Core Supply Voltage: 3.3V
• Embedded Interface Type: CAN, I2C, SPI, UART
• No. Of I/o's: 85
• Flash Memory Size: 256KB
• Supply Voltage Range: 3V To 3.6V
• Rohs Compliant: Yes
• Package: 100TQFP
• Device Core: dsPIC
• Family Name: dSPIC33
• Maximum Speed: 40 MHz
• Operating Supply Voltage: 3.3 V
• Data Bus Width: 16 Bit
• Number Of Programmable I/os: 85
• Interface Type: CAN/I2C/SPI/UART
• On-chip Adc: 32-chx10-bit|32-chx12-bit
• Number Of Timers: 9
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

 2009 Microchip Technology Inc.
80-Lead Plastic Thin Quad Flatpack (PT) – 12x12x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
e
b
c
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
β
N
dsPIC33FJXXXGPX06A/X08A/X10A
1 2 3
D
D1
Dimension Limits
Preliminary
E1
φ
NOTE 2
Units
L
D1
A2
A1
L1
E1
N
A
E
D
e
L
φ
c
b
α
β
E
A1
A
MIN
0.95
0.05
0.45
0.09
0.17
11°
11°
0°
–
MILLIMETERS
L1
14.00 BSC
14.00 BSC
12.00 BSC
12.00 BSC
0.50 BSC
1.00 REF
NOM
1.00
0.60
0.22
3.5°
12°
12°
80
–
–
–
Microchip Technology Drawing C04-092B
MAX
1.20
1.05
0.15
0.75
0.20
0.27
13°
13°
7°
A2
DS70593B-page 323
α