MC9S08QE16CFT Freescale Semiconductor, MC9S08QE16CFT Datasheet - Page 29
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MC9S08QE16CFT
Manufacturer Part Number
MC9S08QE16CFT
Description
MCU 8BIT 16K FLASH MEM 48-QFN
Manufacturer
Freescale Semiconductor
Series
HCS08r
Specifications of MC9S08QE16CFT
Core Processor
HCS08
Core Size
8-Bit
Speed
50MHz
Connectivity
I²C, LIN, SCI, SPI
Peripherals
LVD, PWM, WDT
Number Of I /o
38
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-QFN
Processor Series
S08QE
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
SCI
Maximum Clock Frequency
50.33 MHz
Number Of Programmable I/os
40
Number Of Timers
12
Operating Supply Voltage
- 0.3 V to + 3.8 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMOQE128, EVBQE128
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 10 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S08QE16CFT
Manufacturer:
FREESCALE
Quantity:
20 000
3.13
This section provides details about program/erase times and program-erase endurance for flash memory.
Program and erase operations do not require any special power sources other than the normal V
For more detailed information about program/erase operations, see MC9S08QE32 Series Reference
Manual Chapter 4 Memory.
Freescale Semiconductor
1
2
3
4
1
2
3
4
5
Typical values assume V
only and are not tested in production.
1 LSB = (V
Monotonicity and No-missing-codes guaranteed in 10-bit and 8-bit modes
Based on input pad leakage current. Refer to pad electricals.
These values are hardware state machine controlled. User code does not need to count cycles. This information is
supplied for calculating approximate time to program and erase.
The program and erase currents are additional to the standard run I
with V
Typical endurance for flash was evaluated for this product family on the 9S12Dx64. For additional information on how
Freescale defines typical endurance, please refer to Engineering Bulletin EB619, Typical Endurance for Nonvolatile
Memory.
Typical data retention values are based on intrinsic capability of the technology measured at high temperature and
de-rated to 25°C using the Arrhenius equation. For additional information on how Freescale defines typical data retention,
please refer to Engineering Bulletin EB618, Typical Data Retention for Nonvolatile Memory.
The frequency of this clock is controlled by software setting.
C
D
D
D
D
P
P
P
P
C
C
DD
Flash Specifications
Supply voltage for program/erase
–40 °C to 85 °C
Supply voltage for read operation
Internal FCLK frequency
Internal FCLK period (1/FCLK)
Byte program time (random location)
Byte program time (burst mode)
Page erase time
Mass erase time
Byte program current
Page erase current
Program/erase endurance
Data retention
REFH
= 3.0 V, bus frequency = 4.0 MHz.
T
T = 25 °C
L
to T
– V
H
REFL
= –40 °C to 85 °C
Characteristic
5
DDAD
)/2
2
(2)
N
3
= 3.0 V, Temp = 25 °C, f
3
1
4
MC9S08QE32 Series MCU Data Sheet, Rev. 6
(2)
Table 18. Flash Characteristics
(2)
ADCK
V
Symbol
prog/erase
R
R
V
f
= 1.0 MHz unless otherwise stated. Typical values are for reference
t
t
t
t
t
t
FCLK
IDDBP
IDDPE
D_ret
Burst
Page
Mass
Fcyc
Read
prog
DD
10,000
. These values are measured at room temperatures
Min
150
1.8
1.8
—
—
15
5
100,000
Typical
20,000
4000
100
—
—
—
—
—
9
4
4
6
Electrical Characteristics
Max
6.67
200
3.6
3.6
—
—
—
—
—
DD
cycles
years
t
t
t
t
Unit
kHz
mA
mA
Fcyc
Fcyc
Fcyc
Fcyc
μs
V
V
supply.
29