MC9S08LL16CLF Freescale Semiconductor, MC9S08LL16CLF Datasheet - Page 11
![IC MCU 8BIT 16K FLASH 48-LQFP](/photos/12/16/121629/mc9s08ll16clf_sml.jpg)
MC9S08LL16CLF
Manufacturer Part Number
MC9S08LL16CLF
Description
IC MCU 8BIT 16K FLASH 48-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.DEMO9S08LL16.pdf
(44 pages)
Specifications of MC9S08LL16CLF
Core Processor
HCS08
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SCI, SPI
Peripherals
LCD, LVD, POR, PWM, WDT
Number Of I /o
31
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-LQFP
Processor Series
S08LL
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
2080 B
Interface Type
I2C/SCI/SPI
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
31
Number Of Timers
1
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
TWR-SER, TWR-ELEV, TWR-S08LL64, TWR-SENSOR-PAK, TWR-S08LL64-KIT, TWR-LCD
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 12-bit
Controller Family/series
HCS08
No. Of I/o's
31
Ram Memory Size
2080Byte
Cpu Speed
20MHz
No. Of Timers
2
Embedded Interface Type
I2C, SCI, SPI
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S08LL16CLF
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
3.4
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and voltage regulator circuits, and it is user-determined rather than being controlled by the
MCU design. To take P
voltage and V
pin current (heavy loads), the difference between pin voltage and V
The average chip-junction temperature (T
where:
For most applications, P
(if P
Solving
Freescale Semiconductor
I/O
T
P
P
P
JA
D
int
I/O
A
is neglected) is:
= Ambient temperature, C
= P
Equation 3-1
= Package thermal resistance, junction-to-ambient, C/W
= I
= Power dissipation on input and output pins — user determined
Thermal Characteristics
int
DD
SS
P
V
or V
I/O
Operating temperature range
(packaged)
Maximum junction temperature
Thermal resistance
Thermal resistance
DD
Single-layer board
Four-layer board
DD
and
, Watts — chip internal power
I/O
I/O
and multiply by the pin current for each I/O pin. Except in cases of unusually high
64-pin LQFP
48-pin QFN
48-pin LQFP
64-pin LQFP
48-pin QFN
48-pin LQFP
into account in power calculations, determine the difference between actual pin
Equation 3-2
P
Rating
K = P
int
MC9S08LL16 Series MCU Data Sheet, Rev. 6
and can be neglected. An approximate relationship between P
Table 5. Thermal Characteristics
D
P
T
(T
D
for K gives:
J
= K (T
J
= T
) in C can be obtained from:
A
+ 273C) +
A
+ (P
J
D
+ 273C)
Symbol
T
JA
T
JM
JA
JA
JA
A
)
(P
D
)
2
SS
–40 to 85
T
Value
L
or V
95
72
84
81
54
30
57
to T
H
DD
will be very small.
C/W
C/W
Electrical Characteristics
Unit
C
C
D
Eqn. 3-1
Eqn. 3-2
Eqn. 3-3
and T
11
J