MCF51QE128CLH Freescale Semiconductor, MCF51QE128CLH Datasheet - Page 32
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MCF51QE128CLH
Manufacturer Part Number
MCF51QE128CLH
Description
IC MCU 32BIT 128K FLASH 64-LQFP
Manufacturer
Freescale Semiconductor
Series
MCF51QEr
Specifications of MCF51QE128CLH
Core Processor
Coldfire V1
Core Size
32-Bit
Speed
50MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, PWM, WDT
Number Of I /o
54
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 20x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
MCF51QE
Core
ColdFire V1
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
SCI/SPI
Maximum Clock Frequency
50.33 MHz
Number Of Programmable I/os
54
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Development Tools By Supplier
EVBQE128, DEMOQE128
Minimum Operating Temperature
- 40 C
On-chip Adc
20-ch x 12-bit
For Use With
EVBQE128 - BOARD EVAL FLEXIS QE128 FAMILYDEMOQE128 - DEMO BOARD FOR QE128 FLEXIS
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCF51QE128CLH
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Package Information
32
SEATING
PLANE
–H–
–T–
–L–
DATE 09/21/95
0.05 (0.002)
20
1
4X
C
80
21
3X
0.20 (0.008) H
Figure 23. 80-pin LQFP Package Drawing (Case 917A, Doc #98ASS23237W)
VIEW Y
S1
C2
A1
S
C1
(W)
VIEW AA
A
S
L–M
–N–
N
(Z)
8X
(K)
E
2
1
2X R
MCF51QE128 Series Data Sheet, Rev. 7
40
61
R1
4X 20 TIPS
60
41
–M–
0.20 (0.008) T
B1
VIEW AA
CASE 917A-02
0.25 (0.010)
V1
0.10 (0.004) T
ISSUE C
GAGE
PLANE
B
V
L–M
N
NOTES:
C L
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED
5. DIMENSIONS S AND V TO BE DETERMINED AT
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
7. DIMENSION D DOES NOT INCLUDE DAMBAR
Y14.5M, 1982.
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
AT DATUM PLANE –H–.
SEATING PLANE –T–.
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE LEAD WIDTH TO EXCEED 0.460
(0.018). MINIMUM SPACE BETWEEN
PROTRUSION AND ADJACENT LEAD OR
PROTRUSION 0.07 (0.003).
DIM
A1
B1
C1
C2
R1
S1
V1
01
02
G
W
A
B
C
D
E
F
J
K
P
S
U
V
Z
0
0.13 (0.005)
AB
AB
ROTATED 90 CLOCKWISE
MILLIMETERS
MIN
0.04
1.30
0.22
0.40
0.17
0.09
0.10
0.09
–––
J
14.00 BSC
14.00 BSC
0.325 BSC
16.00 BSC
16.00 BSC
SECTION AB–AB
7.00 BSC
7.00 BSC
0.65 BSC
0.50 REF
8.00 BSC
8.00 BSC
0.20 REF
1.00 REF
0
0
9
Í Í Í Í
Ç Ç Ç
Í Í Í Í
Ç Ç Ç
PLATING
MAX
1.60
0.24
1.50
0.38
0.75
0.33
0.27
0.20
0.16
10
–––
14
VIEW Y
M
F
D
0.002
0.051
0.009
0.016
0.007
0.004
0.004
0.004
Freescale Semiconductor
MIN
T
–––
0.551 BSC
0.276 BSC
0.551 BSC
0.276 BSC
0.026 BSC
0.020 REF
0.013 REF
0.630 BSC
0.315 BSC
0.630 BSC
0.315 BSC
0.008 REF
0.039 REF
0
0
9
INCHES
L–M
G
U
MAX
0.063
0.009
0.059
0.015
0.030
0.013
0.011
0.008
0.006
10
–––
14
S
–X–
X= L, M, N
METAL
BASE
N
P
S