M30622SAFP#U5 Renesas Electronics America, M30622SAFP#U5 Datasheet - Page 57
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M30622SAFP#U5
Manufacturer Part Number
M30622SAFP#U5
Description
IC M16C MPU ROMLESS 100QFP
Manufacturer
Renesas Electronics America
Series
M16C™ M16C/60r
Datasheets
1.QSK-62P_PLUS.pdf
(103 pages)
2.M30622SAFPU5.pdf
(277 pages)
3.M30622SAFPU5.pdf
(617 pages)
4.M30622SAFPU5.pdf
(308 pages)
Specifications of M30622SAFP#U5
Core Processor
M16C/60
Core Size
16-Bit
Speed
16MHz
Connectivity
SIO, UART/USART
Peripherals
DMA, PWM, WDT
Number Of I /o
50
Program Memory Type
ROMless
Ram Size
3K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 85°C
Package / Case
100-QFP
For Use With
867-1000 - KIT QUICK START RENESAS 62PM3062PT3-CPE-3 - EMULATOR COMPACT M16C/62P/30P
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
M16C/62P Group (M16C/62P, M16C/62PT)
Rev.2.41
REJ03B0001-0241
Switching Characteristics
(V
CC1
Table 5.29
NOTES:
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
d(BCLK-AD)
h(BCLK-AD)
h(RD-AD)
h(WR-AD)
d(BCLK-CS)
h(BCLK-CS)
h(RD-CS)
h(WR-CS)
d(BCLK-RD)
h(BCLK-RD)
d(BCLK-WR)
h(BCLK-WR)
d(BCLK-DB)
h(BCLK-DB)
d(DB-WR)
h(WR-DB)
d(BCLK-HLDA)
d(BCLK-ALE)
h(BCLK-ALE)
d(AD-ALE)
h(AD-ALE)
d(AD-RD)
d(AD-WR)
dz(RD-AD)
Symbol
1. Calculated according to the BCLK frequency as follows:
2. Calculated according to the BCLK frequency as follows:
3. Calculated according to the BCLK frequency as follows:
4. Calculated according to the BCLK frequency as follows:
= V
CC2
Jan 10, 2006
----------------------- - 10 ns
f BCLK
(
----------------------------------- - 40 ns
----------------------- - 25 ns
f BCLK
----------------------- - 15 ns
f BCLK
0.5x10
0.5x10
0.5x10
(
(
(
n 0.5
f BCLK
–
= 5V, V
(
Address Output Delay Time
Address Output Hold Time (in relation to BCLK)
Address Output Hold Time (in relation to RD)
Address Output Hold Time (in relation to WR)
Chip Select Output Delay Time
Chip Select Output Hold Time (in relation to BCLK)
Chip Select Output Hold Time (in relation to RD)
Chip Select Output Hold Time (in relation to WR)
RD Signal Output Delay Time
RD Signal Output Hold Time
WR Signal Output Delay Time
WR Signal Output Hold Time
Data Output Delay Time (in relation to BCLK)
Data Output Hold Time (in relation to BCLK)
Data Output Delay Time (in relation to WR)
Data Output Hold Time (in relation to WR)
HLDA Output Delay Time
ALE Signal Output Delay Time (in relation to BCLK)
ALE Signal Output Hold Time (in relation to BCLK)
ALE Signal Output Delay Time (in relation to Address)
ALE Signal Output Hold Time (in relation to Address)
RD Signal Output Delay From the End of Address
WR Signal Output Delay From the End of Address
Address Output Floating Start Time
9
9
9
access and multiplex bus selection)
Memory Expansion and Microprocessor Modes (for 2- to 3-wait setting, external area
) x10
)
)
)
–
–
–
)
SS
9
[
[
[
–
= 0V, at T
]
]
]
[
Page 55 of 96
]
n is “2” for 2-wait setting, “3” for 3-wait setting.
opr
Parameter
= −20 to 85°C / −40 to 85°C unless otherwise specified)
See
Figure 5.2
(NOTE 1)
(NOTE 1)
(NOTE 1)
(NOTE 1)
(NOTE 2)
(NOTE 1)
(NOTE 3)
(NOTE 4)
V
Min.
CC1
− 4
5. Electrical Characteristics
4
4
0
0
4
0
0
Standard
=V
Max.
25
25
25
25
40
40
15
8
CC2
=5V
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns