MC9S12DB128CFUE Freescale Semiconductor, MC9S12DB128CFUE Datasheet - Page 8

• Manufacturer Part Number: MC9S12DB128CFUE
• Description: IC MCU 128K FLASH 2K EE 80-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12DB128CFUE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I²C, SCI, SPI
• Peripherals: PWM, WDT
• Number Of I /o: 59
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 2K x 8
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-QFP
• Processor Series: S12D
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: CAN, SCI, SPI
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 59
• Number Of Timers: 8
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: M68KIT912DP256
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (10 bit, 8 Channel)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MC9S12DT128B Device User Guide — V01.09
Section 7 Clock and Reset Generator (CRG) Block Description . . . . . . . . . 77
7.1
7.1.1
Section 8 Enhanced Capture Timer (ECT) Block Description . . . . . . . . . . . . 77
Section 9 Analog to Digital Converter (ATD) Block Description. . . . . . . . . . 77
Section 10 Inter-IC Bus (IIC) Block Description . . . . . . . . . . . . . . . . . . . . . . . 77
Section 11 Serial Communications Interface (SCI) Block Description. . . . . 77
Section 12 Serial Peripheral Interface (SPI) Block Description . . . . . . . . . . 78
Section 13 J1850 (BDLC) Block Description. . . . . . . . . . . . . . . . . . . . . . . . . . 78
Section 14 Byteflight (BF) Block Description . . . . . . . . . . . . . . . . . . . . . . . . . 78
Section 15 Pulse Width Modulator (PWM) Block Description . . . . . . . . . . . . 78
Section 16 Flash EEPROM 128K Block Description . . . . . . . . . . . . . . . . . . . 78
Section 17 EEPROM 2K Block Description. . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Section 18 RAM Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Section 19 MSCAN Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Section 20 Port Integration Module (PIM) Block Description . . . . . . . . . . . . 79
Section 21 Voltage Regulator (VREG) Block Description . . . . . . . . . . . . . . . 79
Section 22 Printed Circuit Board Layout Proposal . . . . . . . . . . . . . . . . . . . . 80
Appendix A Electrical Characteristics
A.1
A.1.1
A.1.2
Device-specific information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .85
XCLKS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
Parameter Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .85
Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .85
Freescale Semiconductor, Inc.
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