PIC12F508-I/MC Microchip Technology, PIC12F508-I/MC Datasheet - Page 71

• Manufacturer Part Number: PIC12F508-I/MC
• Description: IC PIC MCU FLASH 512X12 8DFN
• Manufacturer: Microchip Technology
• Series: PIC® 12Fr

Specifications of PIC12F508-I/MC

• Core Size: 8-Bit
• Program Memory Size: 768B (512 x 12)
• Core Processor: PIC
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 5
• Program Memory Type: FLASH
• Ram Size: 25 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DFN
• Controller Family/series: PIC12
• No. Of I/o's: 6
• Ram Memory Size: 25Byte
• Cpu Speed: 4MHz
• No. Of Timers: 1
• Digital Ic Case Style: DFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164334 - MODULE SOCKET FOR 8L 2X3MM DFNAC162059 - HEADER INTRFC MPLAB ICD2 8/14PINDVA12XP080 - ADAPTER DEVICE FOR MPLAB-ICE
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

10.1
© 2009 Microchip Technology Inc.
DC Characteristics
D001
D002
D003
D004
D010
D020
D022
Note 1:
Param
No.
2:
3:
4:
5:
*
DC Characteristics: PIC12F508/509/16F505 (Industrial)
Sym.
V
S
I
V
V
WDT
I
I
POR
VDD
DD
PD
These parameters are characterized but not tested.
Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design
guidance only and is not tested.
This is the limit to which V
The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on
the current consumption.
The test conditions for all I
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
V
For standby current measurements, the conditions are the same as IDD, except that the device is in Sleep
mode. If a module current is listed, the current is for that specific module enabled and the device in Sleep.
DD
DR
DD
; WDT enabled/disabled as specified.
Supply Voltage
RAM Data Retention Voltage
V
Power-on Reset
V
Power-on Reset
Supply Current
Power-down Current
WDT Current
DD
DD
Start Voltage to ensure
Rise Rate to ensure
Characteristic
(5)
(3,4)
DD
DD
(5)
can be lowered in Sleep mode without losing RAM data.
measurements in active operation mode are:
(2)
Standard Operating Conditions (unless otherwise specified)
Operating Temperature -40°C ≤ T
0.05*
Min.
2.0
—
—
—
—
—
—
—
—
—
—
—
—
PIC12F508/509/16F505
Typ
0.625
0.35
1.5*
Vss
175
500
1.5
0.1
1.0
7.0
38
—
11
(1)
Max.
16.0
275
650
5.5
1.1
2.2
1.2
2.4
3.0
20
54
—
—
—
Units
V/ms
mA
mA
μA
μA
μA
μA
μA
μA
μA
μA
V
V
V
See Figure 10-1
Device in Sleep mode
See Section 7.4 "Power-on
Reset (POR)" for details
See Section 7.4 "Power-on
Reset (POR)" for details
F
F
F
F
(PIC16F505 only)
F
F
V
V
V
V
A
OSC
OSC
OSC
OSC
OSC
OSC
DD
DD
DD
DD
≤ +85°C (industrial)
= 2.0V
= 5.0V
= 2.0V
= 5.0V
= 4 MHz, V
= 4 MHz, V
= 10 MHz, V
= 20 MHz, V
= 32 kHz, V
= 32 kHz, V
SS
, T0CKI = V
Conditions
DS41236E-page 71
DD
DD
DD
DD
DD
DD
= 2.0V
= 5.0V
DD
= 2.0V
= 5.0V
= 3.0V
= 5.0V
, MCLR =