PIC24F04KA200-I/ST Microchip Technology, PIC24F04KA200-I/ST Datasheet - Page 6

• Manufacturer Part Number: PIC24F04KA200-I/ST
• Description: IC PIC MCU FLASH 512KX4 14-TSSOP
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 24Fr

Specifications of PIC24F04KA200-I/ST

• Program Memory Type: FLASH
• Program Memory Size: 4KB (1.375K x 24)
• Package / Case: 14-TSSOP
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I²C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 12
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 7x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC24F
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 512 B
• Interface Type: I2C/SPI/UART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 3
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, DM240001
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 7-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC24F04KA201 FAMILY
APPENDIX A:
Rev A Document (6/2009)
Initial release of this document; issued for revision A1.
Includes silicon issues 1 (Resets – BOR), 2 (Core –
Deep Sleep), 3 (Comparator) and 4 (SPI – Enhanced
Buffer Mode).
Rev B Document (2/2011)
Adds new silicon issues 5 (Core – Low Power BOR),
6 and 7 (Comparators), and 8 (Core – Doze Mode) to
silicon revision A1.
Added
Specifications – DC Specifications) to revision B of the
data sheet.
DS80474B-page 6
data
sheet
DOCUMENT
REVISION HISTORY
clarification
1
(Electrical
 2011 Microchip Technology Inc.