PIC16F628-04I/SO Microchip Technology, PIC16F628-04I/SO Datasheet - Page 162

• Manufacturer Part Number: PIC16F628-04I/SO
• Description: IC MCU FLASH 2KX14 COMP 18SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F628-04I/SO

• Program Memory Type: FLASH
• Program Memory Size: 3.5KB (2K x 14)
• Package / Case: 18-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 16
• Eeprom Size: 128 x 8
• Ram Size: 224 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 224 B
• Interface Type: SCI/USART
• Maximum Clock Frequency: 4 MHz
• Number Of Programmable I/os: 16
• Number Of Timers: 3
• Operating Supply Voltage: 3 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
• Minimum Operating Temperature: - 40 C
• Data Rom Size: 128 B
• Height: 2.31 mm
• Length: 11.53 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 3 V
• Width: 7.49 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT18SO-1 - SOCKET TRANSITION 18SOIC 300MILAC164010 - MODULE SKT PROMATEII DIP/SOIC
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: PIC16F628-04I/SOR; PIC16F628-04I/SOR

PIC16F62X
K04-072 20-Lead Plastic Shrink Small Outline (SS) – 5.30 mm
DS40300C-page 160
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-150
Drawing No. C04-072
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Foot Length
Lead Thickness
Foot Angle
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
n
p
β
Dimension Limits
E1
E
Units
A2
A1
E1
E
D
B
n
p
A
L
c
α
φ
β
Preliminary
MIN
2
1
.068
.064
.002
.299
.278
.022
.004
.010
.201
0
0
0
D
φ
L
INCHES*
NOM
.026
.073
.068
.006
.309
.207
.284
.030
.007
.013
20
A1
4
5
5
A
MAX
.078
.072
.010
.322
.212
.289
.037
.010
.015
10
10
8
MIN
1.73
1.63
0.05
7.59
7.06
0.56
0.10
0.00
0.25
5.11
0
0
MILLIMETERS
 2003 Microchip Technology Inc.
NOM
101.60
1.85
0.15
7.85
5.25
0.75
0.65
1.73
7.20
0.18
0.32
20
5
5
MAX
203.20
A2
1.98
1.83
0.25
8.18
5.38
7.34
0.94
0.25
0.38
α
10
10