PIC18LF2321-I/SS Microchip Technology, PIC18LF2321-I/SS Datasheet - Page 372
![IC PIC MCU FLASH 4KX16 28SSOP](/photos/6/81/68119/150-28-ssop_sml.jpg)
PIC18LF2321-I/SS
Manufacturer Part Number
PIC18LF2321-I/SS
Description
IC PIC MCU FLASH 4KX16 28SSOP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F2221-ISO.pdf
(402 pages)
3.PIC18F2221-ISO.pdf
(8 pages)
4.PIC18F2221-ISO.pdf
(30 pages)
5.PIC18F2221-ISO.pdf
(46 pages)
6.PIC18F2321-IML.pdf
(396 pages)
Specifications of PIC18LF2321-I/SS
Core Size
8-Bit
Program Memory Size
8KB (4K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SSOP
Controller Family/series
PIC18
No. Of I/o's
25
Eeprom Memory Size
256Byte
Ram Memory Size
512Byte
Cpu Speed
40MHz
No. Of Timers
4
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- PIC16F616T-ISL PDF datasheet
- PIC18F2221-ISO PDF datasheet #2
- PIC18F2221-ISO PDF datasheet #3
- PIC18F2221-ISO PDF datasheet #4
- PIC18F2221-ISO PDF datasheet #5
- PIC18F2321-IML PDF datasheet #6
- Current page: 372 of 396
- Download datasheet (7Mb)
PIC18F4321 FAMILY
DS39689E-page 370
28-Lead Plastic Small Outline (SO or OI) – Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
N
1 2 3
b
D
Dimension Limits
e
Preliminary
Units
A2
E1
A2
A1
E1
L1
N
D
A
E
α
e
h
L
φ
c
b
β
α
E
0.10
0.25
0.40
0.31
MIN
2.05
0.18
φ
0°
5°
5°
–
L1
L
MILLIMETERS
10.30 BSC
17.90 BSC
1.27 BSC
7.50 BSC
1.40 REF
h
NOM
28
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-052B
h
© 2007 Microchip Technology Inc.
MAX
2.65
0.30
0.75
1.27
0.33
0.51
15°
15°
β
8°
–
c
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