PIC16LC621-04/P Microchip Technology, PIC16LC621-04/P Datasheet - Page 83
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PIC16LC621-04/P
Manufacturer Part Number
PIC16LC621-04/P
Description
IC MCU OTP 1KX14 COMP 18DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheet
1.PIC16C620A-04SO.pdf
(128 pages)
Specifications of PIC16LC621-04/P
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
13
Program Memory Size
1.75KB (1K x 14)
Program Memory Type
OTP
Ram Size
80 x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 6 V
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Package / Case
18-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Connectivity
-
12.0
Absolute Maximum Ratings †
Ambient Temperature under bias .............................................................................................................. -40° to +125°C
Storage Temperature ................................................................................................................................ -65° to +150°C
Voltage on any pin with respect to V
Voltage on V
Voltage on MCLR with respect to V
Voltage on RA4 with respect to V
Total power Dissipation (Note 1)...............................................................................................................................1.0W
Maximum Current out of V
Maximum Current into V
Input Clamp Current, I
Output Clamp Current, I
Maximum Output Current sunk by any I/O pin ........................................................................................................25 mA
Maximum Output Current sourced by any I/O pin...................................................................................................25 mA
Maximum Current sunk by PORTA and PORTB...................................................................................................200 mA
Maximum Current sourced by PORTA and PORTB..............................................................................................200 mA
2003 Microchip Technology Inc.
† NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note 1: Power dissipation is calculated as follows: P
2: Voltage spikes below V
ELECTRICAL SPECIFICATIONS
a series resistor of 50-100Ω should be used when applying a "low" level to the MCLR pin rather than pulling
this pin directly to V
DD
with respect to V
IK
OK
DD
(V
SS
I
(V
pin .............................................................................................................................250 mA
<0 or V
pin ..........................................................................................................................300 mA
O
<0 or V
SS
SS
SS
.
SS
SS
I
...........................................................................................................................8.5V
> V
SS
................................................................................................................ 0 to +7.5V
at the MCLR pin, inducing currents greater than 80 mA, may cause latchup. Thus,
(Note 2) .................................................................................................0 to +14V
O
(except V
DD
>V
) ...................................................................................................................... ±20 mA
DD
)................................................................................................................ ±20 mA
DD
and MCLR) .......................................................-0.6V to V
DIS
= V
DD
x {I
DD
- ∑ I
OH
} + ∑ {(V
DD
PIC16C62X
-V
OH
) x I
OH
DS30235J-page 81
} + ∑(V
DD
O
l x I
+0.6V
OL
).