MCF5211CAE66 Freescale Semiconductor, MCF5211CAE66 Datasheet - Page 29
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MCF5211CAE66
Manufacturer Part Number
MCF5211CAE66
Description
IC MCU 128K FLASH 66MHZ 64-LQFP
Manufacturer
Freescale Semiconductor
Series
MCF521xr
Datasheet
1.MCF5213CAF80.pdf
(54 pages)
Specifications of MCF5211CAE66
Core Processor
Coldfire V2
Core Size
32-Bit
Speed
66MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
33
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
MCF521x
Core
ColdFire V2
Data Bus Width
32 bit
Data Ram Size
16 KB
Interface Type
I2C/QSPI/UART
Maximum Clock Frequency
66 MHz
Number Of Programmable I/os
56
Number Of Timers
10
Operating Supply Voltage
3 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Development Tools By Supplier
M52210DEMO, M52211EVB
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 12-bit
Package
64LQFP
Device Core
ColdFire
Family Name
MCF521x
Maximum Speed
66 MHz
For Use With
M5211DEMO - KIT DEMO FOR MCF5211
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCF5211CAE66
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Freescale Semiconductor
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81 MAPBGA Junction to ambient, natural convection
θ
recommends the use of θ
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the Ψ
dissipation, and the method described in EIA/JESD Standard 51-2.
Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board JESD51-7) horizontal.
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
in conformance with Psi-JT.
64 LQFP
JA
64 QFN
and Ψ
jt
parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
Junction to ambient, natural convection
Junction to ambient, (@200 ft/min)
Junction to ambient, (@200 ft/min)
Junction to board
Junction to case
Junction to top of package
Maximum operating junction temperature
Junction to ambient, natural convection
Junction to ambient, natural convection
Junction to ambient (@200 ft/min)
Junction to ambient (@200 ft/min)
Junction to board
Junction to case
Junction to top of package
Maximum operating junction temperature
Junction to ambient, natural convection
Junction to ambient, natural convection
Junction to ambient (@200 ft/min)
Junction to ambient (@200 ft/min)
Junction to board
Junction to case (bottom)
Junction to top of package
Maximum operating junction temperature
JA
and power dissipation specifications in the system design to prevent device junction
Table 23. Thermal Characteristics (continued)
MCF5213 ColdFire Microcontroller, Rev. 4
Characteristic
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural convection
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural convection
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural convection
—
—
—
—
—
—
—
—
—
Symbol
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
Ψ
Ψ
Ψ
JMA
JMA
JMA
JMA
JMA
JMA
T
T
T
JA
JA
JB
JC
JA
JA
JB
JC
JA
JA
JB
JC
jt
jt
j
jt
j
jt
j
parameter, the device power
Electrical Characteristics
Value
61
35
50
31
62
43
50
36
68
24
55
19
0.6
105
105
105
20
12
26
2
9
2
8
3
1,2
2,3
2,3
2,3
6
1,2
1,3
1,3
1,3
5
6
1,2
1,3
1,3
1,3
4
6
4
5
4
5
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
Unit
o
o
o
C
C
C
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