MCIMX513DJM8C Freescale Semiconductor, MCIMX513DJM8C Datasheet - Page 30

• Manufacturer Part Number: MCIMX513DJM8C
• Description: MULTIMEDIA PROC 529-LFBGA
• Manufacturer: Freescale Semiconductor
• Series: i.MX51r

Specifications of MCIMX513DJM8C

• Core Processor: ARM Cortex-A8
• Core Size: 32-Bit
• Speed: 800MHz
• Connectivity: 1-Wire, EBI/EMI, Ethernet, I²C, IrDA, MMC, SPI, SSI, UART/USART, USB OTG
• Peripherals: DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 128
• Program Memory Type: ROMless
• Ram Size: 128K x 8
• Voltage - Supply (vcc/vdd): 0.8 V ~ 1.15 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 85°C
• Package / Case: 529-LFBGA
• Processor Series: i.MX51
• Core: ARM Cortex A8
• Data Bus Width: 32 bit
• Program Memory Size: 36 KB
• Data Ram Size: 128 KB
• Interface Type: I2C, SPI, SSI, UART, USB
• Maximum Clock Frequency: 200 MHz
• Number Of Timers: 5
• Operating Supply Voltage: 0.8 V to 1.15 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: MCIMX51EVKJ
• Minimum Operating Temperature: - 20 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Electrical Characteristics
Table 25
operating temperatures in
30
Output High Voltage
Output Low Voltage
.
NANDF
EIM
DRAM
CSI1, CSI2,
DISP1_Data[5:0]
I
DI1_DAT[23:6],
DISPB_SER_x,
DI_GPx
CKIL, PMIC_x
EXTAL, XTAL
ID, GPANAIO
DISP2_DAT[0:15]
SD1, SD2
Peripherals except
SD1, SD2
2
C1
Parameter
Contact Group
shows the I/O leakage currents that are based on the operating ranges in
i.MX51 Applications Processors for Consumer and Industrial Products, Rev. 4
Table 24. USB Interface Electrical Specification (continued)
VOH
VOL
NVCC_NANDF
NVCC_EMI
NVCC_DRAM
NVCC_HSx
NVCC_I2C
NVCC_IPU
NVCC_SRTC_POW
NVCC_OSC
NVCC_USBPHY
NVCC_IPU,
NVCC_HS
NVCC_PERx
NVCC_PERx
Symbol
Table
Supply Rail
1.
USB_DAT_VP
USB_SE0_VM
USB_TXOE_B
USB_DAT_VP
USB_SE0_VM
USB_TXOE_B
Table 25. I/O Leakage Current
Signals
V[I/O] = GND or Positive
Supply Rail, I/O = High Z
V[I/O] = GND or Positive
Supply Rail, I/O = High Z
V[I/O] = GND or Positive
Supply Rail, I/O = High Z
V[I/O] = GND or Positive
Supply Rail, I/O = High Z
V[I/O] = GND or Positive
Supply Rail, I/O = High Z
V[I/O] = GND or Positive
Supply Rail, I/O = High Z
V[I/O] = GND or Positive
Supply Rail, I/O = High Z
V[I/O] = GND or Positive
Supply Rail, I/O = High Z
V[I/O] = GND or Positive
Supply Rail, I/O = High Z
V[I/O] = GND or Positive
Supply Rail, I/O = High Z
V[I/O] = GND or Positive
Supply Rail, I/O = High Z
V[I/O] = GND or Positive
Supply Rail, I/O = High Z
Test Condition
VDD –0.43
Min
—
0.43
Min
—
—
—
—
—
—
—
—
—
—
—
—
Max
—
Typ
—
—
—
—
—
—
—
—
—
—
—
—
V
V
Unit
Table 13
Freescale Semiconductor
±170
±170
Max
±2.5
±1.5
±10
7 mA Drv
at Iout = 5 mA
7 mA Drv
at Iout = 5 mA
±1
±1
±1
±2
±1
±2
±2
Test Conditions
and the
Unit
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA