MCF5474VR200 Freescale Semiconductor, MCF5474VR200 Datasheet - Page 32

• Manufacturer Part Number: MCF5474VR200
• Description: IC MPU 32BIT COLDF 388-PBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF547xr

Specifications of MCF5474VR200

• Core Processor: Coldfire V4E
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 99
• Program Memory Type: ROMless
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.43 V ~ 1.58 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 388-BGA
• Processor Series: MCF547x
• Core: ColdFire V4
• Data Bus Width: 32 bit
• Development Tools By Supplier: M5475EVBE
• Maximum Clock Frequency: 83 MHz
• Operating Supply Voltage: 3 V to 3.6 V
• Maximum Operating Temperature: + 70 C
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Data Ram Size: 32 KB
• Minimum Operating Temperature: 0 C
• Program Memory Size: 64KB
• Cpu Speed: 200MHz
• Embedded Interface Type: I2C, UART, DMA
• Digital Ic Case Style: BGA
• No. Of Pins: 388
• Rohs Compliant: Yes
• For Use With: M5475EVBGHS - KIT DEV GHS FOR M5475EVBM5474GFE - MODULE M5474 FIRE ENGINEM5474LITEKIT - KIT DEV FOR MCF547X
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Revision History
18
32
Revision
Number
2.2
2.3
2.4
Revision History
3
4
December 14, 2005
February 20, 2007
December 4, 2007
August 29, 2005
August 30, 2005
Date
MCF547x ColdFire
Table
Table
Table
Table
Table
Table
Added
Figure
Figure
or PLL VDD by more than 0.4V...” to “IVDD should not exceed EVDD or SD
VDD by more than 0.4V...”
Table
Table
Table
current.
Table
Added features list, pinout drawing, block diagram, and case outline.
7: Changed C1 maximum spec from 33.3 ns to 40 ns.
22: Changed J11 maximum from 15 ns to 20 ns.
10: Changed FB1 maximum from 33.33 ns to 40 ns.
14: Changed FB1 maximum from 33.33 ns to 40 ns.
4: Updated DC electrical specifications, V
6: Changed FlexBus output load from 20pF to 30pF.
3: Updated thermal information for θ
4: Added input leakage current spec.
6: Added footnote regarding pads having balanced source & sink
9: Added RSTI pulse duration spec.
Section 4.3, “General USB Layout
2: Changed resistor value from 10W to 10Ω
3: Changed note 1 in from “IVDD should not exceed EVDD, SD VDD
®
Microprocessor, Rev. 4
Substantive Changes
Guidelines.”
JMA
, θ
IL
JB
and V
, and θ
IH
Freescale Semiconductor
JC
.