MCIMX512CJM6C Freescale Semiconductor, MCIMX512CJM6C Datasheet - Page 197

MULTIMEDIA PROC 529-LFBGA

MCIMX512CJM6C

Manufacturer Part Number
MCIMX512CJM6C
Description
MULTIMEDIA PROC 529-LFBGA
Manufacturer
Freescale Semiconductor
Series
i.MX51r
Datasheets

Specifications of MCIMX512CJM6C

Core Processor
ARM Cortex-A8
Core Size
32-Bit
Speed
600MHz
Connectivity
1-Wire, EBI/EMI, Ethernet, I²C, IrDA, MMC, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
128
Program Memory Type
ROMless
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
0.8 V ~ 1.15 V
Oscillator Type
External
Operating Temperature
-20°C ~ 85°C
Package / Case
529-LFBGA
Operating Temperature (min)
-40C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Processor Series
i.MX51
Core
ARM Cortex A8
Data Bus Width
32 bit
Program Memory Size
36 KB
Data Ram Size
128 KB
Interface Type
I2C, SPI, SSI, UART, USB
Maximum Clock Frequency
200 MHz
Number Of Timers
5
Operating Supply Voltage
0.8 V to 1.15 V
Maximum Operating Temperature
+ 95 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
MCIMX51EVKJ
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
Compliant
Freescale Semiconductor
Number
Rev.
3
4
06/24/2010
08/12/2010
Date
i.MX51 Applications Processors for Consumer and Industrial Products, Rev. 4
Table 135. i.MX51 Data Sheet Document Revision History (continued)
• Updated Max column of
• Updated Symbol, Test Conditions, and Max columns of
• Updated Max and Unit columns of
• Updated Test Conditions, Max, and Unit columns of
• Updated Symbol, Test Conditions, Max, and Unit columns of
• Updated Max and Unit columns of
• Added a new table
• Updated Case Temperature Range column of
• Updated
• Removed table footenote in
• Removed table footnote in
• Updated
Current row from the same table.
Electrical Characteristics," on page
26.
Characteristics," on page 26
Electrical Characteristics," on page
Electrical Parameters for Low/Medium Drive Strength," on page
specification for case temperature for industrial parts.
Consumption," on page
page
47.
Table 13, "i.MX51 Operating Ranges," on page 19
Table 52, "WEIM Interface Pinout in Various Configurations," on page
Table 25, "I/O Leakage Current," on page
Table 15, "Fuse Supply Current," on page
21.
Table 47, "CAMP Electrical Parameters (CKIH1, CKIH2)," on
Table 16, "i.MX51 Stop Mode Current and Power
Substantive Change(s)
Table 19, "DDR2 I/O DC Electrical Parameters," on page
Table 22, "I2C Standard/Fast/High-Speed Mode
25.
27.
Table 1, "Ordering Information," on page
Table 20, "LVIO DC Electrical
Table 18, "GPIO/HSGPIO DC
to include separate
Table 21, "UHVIO DC
30.
28.
21. Deleted eFuse Read
Revision History
54.
3.
197

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