PIC10F206-E/MC Microchip Technology, PIC10F206-E/MC Datasheet - Page 86
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PIC10F206-E/MC
Manufacturer Part Number
PIC10F206-E/MC
Description
IC PIC MCU FLASH 512X12 8DFN
Manufacturer
Microchip Technology
Series
PIC® 10Fr
Datasheets
1.PIC10F200T-IOT.pdf
(96 pages)
2.PIC10F200T-IOT.pdf
(6 pages)
3.PIC10F200T-IOT.pdf
(18 pages)
Specifications of PIC10F206-E/MC
Program Memory Type
FLASH
Program Memory Size
768B (512 x 12)
Package / Case
8-DFN
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
3
Ram Size
24 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC10F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
24 B
Interface Type
USB
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
4
Number Of Timers
1
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164334 - MODULE SOCKET FOR 8L 2X3MM DFNAC163020-2 - ADAPTER PROGRAM PIC10F 2X3 DFN
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
PIC10F200/202/204/206
DS41239D-page 84
8-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
NOTE 1
A
A1
b1
b
1
N
2
D
Dimension Limits
3
e
Units
L
A2
A1
E1
eB
E1
b1
N
D
A
E
e
L
c
b
A2
.015
.290
.240
.348
.115
.008
.040
.014
MIN
.115
–
–
eB
.100 BSC
E
INCHES
NOM
.130
.310
.250
.365
.130
.010
.060
.018
8
–
–
–
Microchip Technology Drawing C04-018B
© 2007 Microchip Technology Inc.
MAX
.210
.195
.325
.280
.400
.150
.015
.070
.022
.430
c
–