PIC16F505-E/SL Microchip Technology, PIC16F505-E/SL Datasheet - Page 109
PIC16F505-E/SL
Manufacturer Part Number
PIC16F505-E/SL
Description
IC MCU FLASH 1KX12 14SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC12F509T-ISN.pdf
(110 pages)
2.PIC16F505-IST.pdf
(4 pages)
3.PIC16F505-IST.pdf
(22 pages)
4.PIC12F509-EMC.pdf
(106 pages)
Specifications of PIC16F505-E/SL
Program Memory Type
FLASH
Program Memory Size
1.5KB (1K x 12)
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
POR, WDT
Number Of I /o
11
Ram Size
72 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
72 B
Interface Type
RS- 232/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
1
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT14SS-1 - SOCKET TRANSITION 14DIP/14SSOPAC162070 - HEADER INTRFC MPLAB ICD2 8/14P
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
© 2009 Microchip Technology Inc.
Device:
Temperature
Range:
Package:
Pattern:
Note:
PART NO.
Device
Tape and Reel available for only the following packages: SOIC, MSOP
and TSSOP.
Temperature
PIC16F505
PIC12F508
PIC12F509
PIC16F505T
PIC12F508T
PIC12F509T
I
E
MC
MS
P
SL
SN
ST
MG
Special Requirements
Range
=
=
X
=
=
=
=
=
=
=
-40°C to +85°C (Industrial)
-40°C to +125°C (Extended)
(1)
(2)
(2)
8L DFN 2x3 (DUAL Flatpack No-Leads)
Micro-Small Outline Package (MSOP)
Plastic (PDIP)
14L Small Outline, 3.90 mm (SOIC)
8L Small Outline, 3.90 mm Narrow (SOIC)
Thin Shrink Small Outline (TSSOP)
16L QFN (3x3x0.9)
Package
/XX
(4)
(5)
Pattern
XXX
(4)
(4)
PIC12F508/509/16F505
(3, 4)
(3, 4)
(4)
Note 1:
Examples:
a)
b)
c)
2:
3:
4:
5:
PIC12F508-E/P 301 = Extended Temp., PDIP
package, QTP pattern #301
PIC12F508-I/SN = Industrial Temp., SOIC
package
PIC12F508T-E/P = Extended Temp., PDIP
package, Tape and Reel
T
T
PIC12F508/PIC12F509 only.
Pb-free.
PIC16F505 only.
= in tape and reel SOIC, TSSOP and
= in tape and reel SOIC and MSOP
QFN packages only
packages only.
.
DS41236E-page 109