PIC16F616-E/ST Microchip Technology, PIC16F616-E/ST Datasheet - Page 213
PIC16F616-E/ST
Manufacturer Part Number
PIC16F616-E/ST
Description
IC PIC MCU FLASH 2KX14 14TSSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC12F609T-ISN.pdf
(26 pages)
2.PIC16F616T-ISL.pdf
(4 pages)
3.PIC16F616T-ISL.pdf
(214 pages)
4.PIC16F616T-ISL.pdf
(8 pages)
5.PIC16F616-ESL.pdf
(180 pages)
Specifications of PIC16F616-E/ST
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
14-TSSOP
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
11
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
11
Number Of Timers
3
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Height
0.9 mm
Length
5 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2 V
Width
4.4 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MCP1631RD-DCPC1 - REF DES BATT CHARG OR LED DRIVERAC162083 - HEADER MPLAB ICD2 PIC16F616 8/14
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
© 2009 Microchip Technology Inc.
Device:
Temperature
Range:
Package:
Pattern:
PART NO.
Device
Temperature
PIC16F610/616/16HV610/616, PIC16F610/616/16HV610/
616T
I
E
H
ML
P
SL
ST
QTP, SQTP or ROM Code; Special Requirements
(blank otherwise)
Range
(1)
X
=
=
=
=
= -40°C to
= -40°C to +125°C
= -40°C to +150°C
Quad Flat No Leads (QFN)
Plastic DIP (PDIP)
14-lead Small Outline (3.90 mm) (SOIC)
Thin Shrink Small Outline (4.4 mm) (TSSOP)
Package
/XX
+85°C
PIC16F610/616/16HV610/616
(Industrial)
(Extended)
(High Temp.)
Pattern
XXX
(2)
Examples:
a)
b)
c)
d)
e)
f)
g)
h)
i)
j)
k)
l)
m)
Note 1:
PIC16F610-E/P 301 = Extended Temp., PDIP
package, 20 MHz, QTP pattern #301
PIC16F616-E/P 301 = Extended Temp., PDIP
package, 20 MHz, QTP pattern #301
PIC16HV610-E/P 301 = Extended Temp.,
PDIP package, 20 MHz, QTP pattern #301
PIC16HV616-E/P 301 = Extended Temp.,
PDIP package, 20 MHz, QTP pattern #301
PIC16F610-I/SL = Industrial Temp., SOIC
package, 20 MHz
PIC16F616-I/SL = Industrial Temp., SOIC
package, 20 MHz
PIC16HV610-I/SL = Industrial Temp., SOIC
package, 20 MHz
PIC16HV616-I/SL = Industrial Temp., SOIC
package, 20 MHz
PIC16F610T-E/ST Tape and Reel, Extended
Temp., TSSOP package, 20 MHz
PIC16F616T-E/ST Tape and Reel, Extended
Temp., TSSOP package, 20 MHz
PIC16HV610T-E/ST Tape and Reel, Extended
Temp., TSSOP package, 20 MHz
PIC16HV616T-E/ST Tape and Reel, Extended
Temp., TSSOP package, 20 MHz
PIC16F616 - H/SL = High Temp., SOIC pack-
age, 20 MHz.
2:
T
and QFN packages only.
High Temp. available for PIC16F616 only.
= in tape and reel for TSSOP, SOIC
.
DS41288F-page 213