PIC12F510-I/MC Microchip Technology, PIC12F510-I/MC Datasheet - Page 109
PIC12F510-I/MC
Manufacturer Part Number
PIC12F510-I/MC
Description
IC PIC MCU FLASH 1024X12 8DFN
Manufacturer
Microchip Technology
Series
PIC® 12Fr
Datasheets
1.PIC12F510-ISN.pdf
(124 pages)
2.PIC12F510-ISN.pdf
(8 pages)
3.PIC12F510-ISN.pdf
(20 pages)
4.PIC12F510-IP.pdf
(116 pages)
Specifications of PIC12F510-I/MC
Program Memory Type
FLASH
Program Memory Size
1.5KB (1K x 12)
Package / Case
8-DFN
Core Processor
PIC
Core Size
8-Bit
Speed
8MHz
Peripherals
POR, WDT
Number Of I /o
5
Ram Size
38 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC12F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
38 B
Interface Type
USB
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
6
Number Of Timers
1
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DV164101, DV164120, DM163029
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit, 3 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164334 - MODULE SOCKET FOR 8L 2X3MM DFNAC163022 - ADAPTER UNIVERSAL PROG PIC12F5XXAC162070 - HEADER INTRFC MPLAB ICD2 8/14PXLT08DFN2 - SOCKET TRANSITION ICE 14DIP/8DFN
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
© 2007 Microchip Technology Inc.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
N
1 2
b
D
Dimension Limits
e
E1
Preliminary
A2
E
Units
c
A2
A1
E1
L1
N
A
E
D
e
L
φ
c
b
L1
0.80
0.05
4.30
4.90
0.45
0.09
0.19
MIN
0°
–
PIC12F510/16F506
MILLIMETERS
0.65 BSC
6.40 BSC
1.00 REF
NOM
1.00
4.40
5.00
0.60
14
–
–
–
–
–
Microchip Technology Drawing C04-087B
MAX
1.20
1.05
0.15
4.50
5.10
0.75
0.20
0.30
8°
DS41268C-page 107
φ
L