PIC12F510-I/MC Microchip Technology, PIC12F510-I/MC Datasheet - Page 68
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PIC12F510-I/MC
Manufacturer Part Number
PIC12F510-I/MC
Description
IC PIC MCU FLASH 1024X12 8DFN
Manufacturer
Microchip Technology
Series
PIC® 12Fr
Datasheets
1.PIC12F510-ISN.pdf
(124 pages)
2.PIC12F510-ISN.pdf
(8 pages)
3.PIC12F510-ISN.pdf
(20 pages)
4.PIC12F510-IP.pdf
(116 pages)
Specifications of PIC12F510-I/MC
Program Memory Type
FLASH
Program Memory Size
1.5KB (1K x 12)
Package / Case
8-DFN
Core Processor
PIC
Core Size
8-Bit
Speed
8MHz
Peripherals
POR, WDT
Number Of I /o
5
Ram Size
38 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC12F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
38 B
Interface Type
USB
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
6
Number Of Timers
1
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DV164101, DV164120, DM163029
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit, 3 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164334 - MODULE SOCKET FOR 8L 2X3MM DFNAC163022 - ADAPTER UNIVERSAL PROG PIC12F5XXAC162070 - HEADER INTRFC MPLAB ICD2 8/14PXLT08DFN2 - SOCKET TRANSITION ICE 14DIP/8DFN
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
PIC12F510/16F506
10.5
On the PIC12F510/16F506 devices, the DRT runs any
time the device is powered up. DRT runs from Reset
and varies based on oscillator selection and Reset type
(see Table 10-6).
The DRT operates from a free running on-chip oscilla-
tor that is separate from INTOSC. The processor is
kept in Reset as long as the DRT is active. The DRT
delay allows V
the oscillator to stabilize.
Oscillator circuits, based on crystals or ceramic resona-
tors, require a certain time after power-up to establish
a stable oscillation. The on-chip DRT keeps the devices
in a Reset for a set period, as stated in Table 10-6, after
MCLR has reached a logic high (V
Programming (GP3/RB3)/MCLR/V
using an external RC network connected to the MCLR
input is not required in most cases. This allows savings
in cost-sensitive and/or space restricted applications,
as well as allowing the use of the (GP3/RB3)/MCLR/
V
The DRT delays will vary from chip-to-chip due to V
temperature
parameters for details.
The DRT will also be triggered upon a Watchdog Timer
time-out from Sleep. This is particularly important for
applications using the WDT to wake from Sleep mode
automatically.
Reset sources are POR, MCLR, WDT time-out, Wake-
up on Pin Change and Wake-up on Comparator
Change. See Section 10.9.2 “Wake-up from Sleep
Reset”, Notes 1, 2 and 3.
10.6
The Watchdog Timer (WDT) is a free running on-chip
RC oscillator that does not require any external
components. This RC oscillator is separate from the
external RC oscillator of the (GP5/RB5)/OSC1/CLKIN
pin and the internal 4/8 MHz oscillator. This means that
the WDT will run even if the main processor clock has
been stopped, for example, by execution of a SLEEP
instruction. During normal operation or Sleep, a WDT
Reset or wake-up Reset generates a device Reset.
The TO bit (STATUS<4>) will be cleared upon a
Watchdog Timer Reset.
The WDT can be permanently disabled by program-
ming the configuration WDTE as a ‘0’ (see
Section 10.1 “Configuration Bits”). Refer to the
PIC12F510/16F506 Programming Specifications to
determine how to access the Configuration Word.
DS41268D-page 66
PP
pin as a general purpose input.
Device Reset Timer (DRT)
Watchdog Timer (WDT)
DD
and
to rise above V
process
variation.
DD
PP
minimum and for
IH
as MCLR and
MCLR) level.
See
DD
AC
,
TABLE 10-6:
10.6.1
The WDT has a nominal time-out period of 18 ms (with
no prescaler). If a longer time-out period is desired, a
prescaler with a divisor ratio of up to 1:128 can be
assigned to the WDT (under software control) by
writing to the OPTION register. Thus, a time-out period
of a nominal 2.3 seconds can be realized. These
periods vary with temperature, V
process variations (see DC specs).
Under worst-case conditions (V
= Max., max. WDT prescaler), it may take several
seconds before a WDT time-out occurs.
10.6.2
The CLRWDT instruction clears the WDT and the
postscaler, if assigned to the WDT, and prevents it from
timing out and generating a device Reset.
The SLEEP instruction resets the WDT and the
postscaler, if assigned to the WDT. This gives the
maximum Sleep time before a WDT wake-up Reset.
LP
XT
HS
EC
INTOSC
EXTRC
Note 1:
Note:
Configuration
(1)
(1)
Oscillator
PIC16F506 only
It is the responsibility of the application
designer to ensure the use of the
1.125 ms nominal DRT will result in
acceptable operation. Refer to Electrical
Specifications for V
stability requirements for this mode of
operation.
WDT PERIOD
WDT PROGRAMMING
CONSIDERATIONS
TYPICAL DRT PERIODS
POR Reset
1.125 ms
1.125 ms
1.125 ms
© 2007 Microchip Technology Inc.
18 ms
18 ms
18 ms
DD
DD
= Min., Temperature
DD
rise time and
and part-to-part
Subsequent
Resets
18 ms
18 ms
18 ms
10 μs
10 μs
10 μs