PIC16F716-E/SO Microchip Technology, PIC16F716-E/SO Datasheet - Page 33
![IC PIC MCU FLASH 2KX14 18SOIC](/photos/6/76/67656/150-18-soic_sml.jpg)
PIC16F716-E/SO
Manufacturer Part Number
PIC16F716-E/SO
Description
IC PIC MCU FLASH 2KX14 18SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F716-ISO.pdf
(136 pages)
4.PIC16F716-ISO.pdf
(12 pages)
5.PIC16F716-ESO.pdf
(126 pages)
Specifications of PIC16F716-E/SO
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
18-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
13
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
RS- 232/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
13
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
4-ch x 8-bit
Data Rom Size
128 B
Height
2.31 mm
Length
11.53 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2 V
Width
7.49 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3-DB16F716 - BOARD DAUGHTER ICEPIC3AC162054 - HEADER INTERFACE ICD2 16F716
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F716-E/SO
Manufacturer:
PIC
Quantity:
5 510
Company:
Part Number:
PIC16F716-E/SO
Manufacturer:
AMD
Quantity:
5 510
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F716-ISO PDF datasheet #3
- PIC16F716-ISO PDF datasheet #4
- PIC16F716-ESO PDF datasheet #5
- Current page: 33 of 688
- Download datasheet (3Mb)
1997 Microchip Technology Inc.
Table 2-1:
Table 2-2:
Configuration bits
FOSC2:FOSC0
Configuration
FOSC1:FOSC0
1 1 1
1 1 0
1 0 1
1 0 0
0 1 1
0 1 0
0 0 1
0 0 0
bits
1 1
1 0
0 1
0 0
Selecting the Oscillator Mode for Devices with FOSC1:FOSC0
Selecting the Oscillator Mode for Devices with FOSC2:FOSC0
CLKOUT
CLKOUT
EXTRC
EXTRC
INTRC
INTRC
Mode
Mode
OSC
OSC
with
with
HS
XT
LP
RC
HS
—
XT
LP
Medium Gain Standard crystal/resonator frequency.
Medium Gain Standard crystal/resonator frequency.
Feedback
High Gain
Low Gain
Feedback
High Gain
Inverter
Low Gain
Inverter
OSC
Gain
OSC
Gain
—
—
—
—
—
—
Section 2. Oscillator
Least expensive solution for device oscillation
(only an external resistor and capacitor is
required). Most variation in time-base.
Device’s default mode.
High frequency application.
Oscillator circuit’s mode consumes the most
current of the three crystal modes.
Oscillator circuit’s mode consumes the middle
current of the three crystal modes.
Low power/frequency applications.
Oscillator circuit’s mode consumes the least
current of the three crystal modes.
Inexpensive solution for device oscillation. Most
variation in timebase. CLKOUT is enabled on
pin. Device’s default mode.
Inexpensive solution for device oscillation. Most
variation in timebase.
CLKOUT is disabled (use as I/O) on pin.
Least expensive solution for device oscillation.
4 MHz oscillator, which can be tuned.
CLKOUT is enabled on pin.
Least expensive solution for device oscillation.
4 MHz oscillator, which can be tuned.
CLKOUT is disabled (use as I/O) on pin.
Reserved
High frequency application.
Oscillator circuit’s mode consumes the most
current of the three crystal modes.
Oscillator circuit’s mode consumes the middle
current of the three crystal modes.
Low power/frequency applications.
Oscillator circuit’s mode consumes the least
current of the three crystal modes.
Comment
Comment
DS31002A-page 2-3
2
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