PIC16F616-E/P Microchip Technology, PIC16F616-E/P Datasheet - Page 168
PIC16F616-E/P
Manufacturer Part Number
PIC16F616-E/P
Description
IC PIC MCU FLASH 2KX14 14DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC12F609T-ISN.pdf
(26 pages)
2.PIC16F616T-ISL.pdf
(4 pages)
3.PIC16F616T-ISL.pdf
(214 pages)
4.PIC16F616T-ISL.pdf
(8 pages)
5.PIC16F616-ESL.pdf
(180 pages)
Specifications of PIC16F616-E/P
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
14-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
11
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
11
Number Of Timers
3
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Height
3.3 mm
Length
19.05 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2 V
Width
6.35 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MCP1631RD-DCPC1 - REF DES BATT CHARG OR LED DRIVERAC162083 - HEADER MPLAB ICD2 PIC16F616 8/14
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- PIC12F609T-ISN PDF datasheet
- PIC16F616T-ISL PDF datasheet #2
- PIC16F616T-ISL PDF datasheet #3
- PIC16F616T-ISL PDF datasheet #4
- PIC16F616-ESL PDF datasheet #5
- Current page: 168 of 180
- Download datasheet (3Mb)
PIC16F610/616/16HV610/616
DS41288C-page 166
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
N
1 2
b
D
Dimension Limits
e
Preliminary
E1
A2
E
Units
c
A2
A1
E1
L1
N
A
E
D
e
L
φ
c
b
L1
0.80
0.05
4.30
0.45
0.19
MIN
4.90
0.09
0°
–
MILLIMETERS
0.65 BSC
6.40 BSC
1.00 REF
NOM
1.00
4.40
5.00
0.60
14
–
–
–
–
–
Microchip Technology Drawing C04-087B
© 2007 Microchip Technology Inc.
MAX
1.20
1.05
0.15
4.50
5.10
0.75
0.20
0.30
8°
φ
L
Related parts for PIC16F616-E/P
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
3.5KB Flash, 128B RAM, 18 I/O, CLC, CWG, DDS, 10-bit ADC 20 QFN 4x4mm TUBE
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
3.5KB Flash, 128B RAM, 18 I/O, CLC, CWG, DDS, 10-bit ADC 20 PDIP .300in TUBE
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
3.5KB Flash, 128B RAM, 18 I/O, CLC, CWG, DDS, 10-bit ADC 20 SOIC .300in TUBE
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
3.5KB Flash, 128B RAM, 18 I/O, CLC, CWG, DDS, 10-bit ADC 20 SSOP .209in TUBE
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
3.5KB Flash, 128B RAM, 18 I/O, CLC, CWG, DDS, 10-bit ADC 20 QFN 4x4mm TUBE
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
3.5KB Flash, 128B RAM, 18 I/O, CLC, CWG, DDS, 10-bit ADC 20 PDIP .300in TUBE
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
3.5KB Flash, 128B RAM, 18 I/O, CLC, CWG, DDS, 10-bit ADC 20 SOIC .300in TUBE
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
3.5KB Flash, 128B RAM, 18 I/O, CLC, CWG, DDS, 10-bit ADC 20 SSOP .209in TUBE
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
3.5KB Flash, 128B RAM, 18 I/O, CLC, CWG, DDS, 10-bit ADC 20 QFN 4x4mm T/R
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
3.5KB Flash, 128B RAM, 18 I/O, CLC, CWG, DDS, 10-bit ADC 20 SOIC .300in T/R
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
3.5KB Flash, 128B RAM, 18 I/O, CLC, CWG, DDS, 10-bit ADC 20 SSOP .209in T/R
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
3.5KB Flash, 128B RAM, 18 I/O, CLC, CWG, DDS, 10-bit ADC 20 QFN 4x4mm TUBE
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
3.5KB Flash, 128B RAM, 18 I/O, CLC, CWG, DDS, 10-bit ADC 20 PDIP .300in TUBE
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
3.5KB Flash, 128B RAM, 18 I/O, CLC, CWG, DDS, 10-bit ADC 20 SOIC .300in TUBE
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
3.5KB Flash, 128B RAM, 18 I/O, CLC, CWG, DDS, 10-bit ADC 20 SSOP .209in TUBE
Manufacturer:
Microchip Technology
Datasheet: