PIC12F615-I/MS Microchip Technology, PIC12F615-I/MS Datasheet - Page 3
![IC PIC MCU FLASH 1KX14 8MSOP](/photos/6/59/65932/mfg_150_c04-111_ms_8-msop_sml.jpg)
PIC12F615-I/MS
Manufacturer Part Number
PIC12F615-I/MS
Description
IC PIC MCU FLASH 1KX14 8MSOP
Manufacturer
Microchip Technology
Series
PIC® 12Fr
Datasheets
1.PIC12F609T-ISN.pdf
(212 pages)
2.PIC12F609T-ISN.pdf
(26 pages)
3.PIC12F609T-ISN.pdf
(8 pages)
4.PIC12F615-ESN.pdf
(168 pages)
Specifications of PIC12F615-I/MS
Core Size
8-Bit
Program Memory Size
1.75KB (1K x 14)
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Core Processor
PIC
Speed
20MHz
Number Of I /o
5
Program Memory Type
FLASH
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
Controller Family/series
PIC12
No. Of I/o's
6
Ram Memory Size
64Byte
Cpu Speed
20MHz
No. Of Timers
3
Processor Series
PIC12F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
64 B
Interface Type
RS-232, USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
5
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 4 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
APGRD004 - REF DESIGN MOD AUTO AMBNT LIGHTAC162083 - HEADER MPLAB ICD2 PIC16F616 8/14AC164325 - MODULE SKT FOR 8MSOPXLT08DFN2 - SOCKET TRANSITION ICE 14DIP/8DFN
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC12F615-I/MS
Manufacturer:
RICHTEK
Quantity:
5 400
Part Number:
PIC12F615-I/MS
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Silicon Errata Issues
1. Module: LP/Timer1 Oscillator Shared
2010 Microchip Technology Inc.
Note:
When using LP oscillator as the system clock and
enabling Timer1 external oscillator, the shared
crystal will clock both the core and Timer1. On
execution of the SLEEP instruction, the oscillator
amplifier will be disabled and Timer1 will not be
clocked while the device is in Sleep.
Work around
None.
Affected Silicon Revisions
A0
X
This document summarizes all silicon
errata issues from all revisions of silicon,
previous as well as current. Only the
issues indicated by the shaded column in
the following tables apply to the current
silicon revision (A0).
Operation
PIC12F609/615/617/PIC12HV609/615
DS80509A-page 3