PIC16F684-E/P Microchip Technology, PIC16F684-E/P Datasheet - Page 142

• Manufacturer Part Number: PIC16F684-E/P
• Description: IC PIC MCU FLASH 2KX14 14DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F684-E/P

• Program Memory Type: FLASH
• Program Memory Size: 3.5KB (2K x 14)
• Package / Case: 14-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 12
• Eeprom Size: 256 x 8
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 3
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM163029 - BOARD PICDEM FOR MECHATRONICSACICE0207 - MPLABICE 14P 300 MIL ADAPTER
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC16F684
TABLE 15-2:
DS41202F-page 140
Standard Operating Conditions (unless otherwise stated)
Operating Temperature
OS06
OS07
OS08
OS09*
OS10*
Note 1:
Param
No.
2:
3:
*
† Data in ‘Typ’ column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only
T
T
HF
LF
T
ST
These parameters are characterized but not tested.
and are not tested.
Instruction cycle period (T
based on characterization data for that particular oscillator type under standard operating conditions with the
device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or
higher than expected current consumption. All devices are tested to operate at ‘min’ values with an external
clock applied to the OSC1 pin. When an external clock input is used, the ‘max’ cycle time limit is ‘DC’ (no clock)
for all devices.
To ensure these oscillator frequency tolerances, V
device as possible. 0.1 μF and 0.01 μF values in parallel are recommended.
By design.
SC
WARM
IOSC
Sym
OSC
OSC
OSCILLATOR PARAMETERS
Internal Oscillator Switch
when running
Fail-Safe Sample Clock
Period
Internal Calibrated
HFINTOSC Frequency
Internal Uncalibrated
LFINTOSC Frequency
HFINTOSC Oscillator
Wake-up from Sleep
Start-up Time
Characteristic
(1)
-40°C ≤ T
(3)
CY
A
≤ +125°C
) equals four times the input oscillator time base period. All specified values are
(2)
Tolerance
Freq
±1%
±2%
±5%
—
—
—
—
—
—
DD
7.92
7.84
7.60
Min
5.5
3.5
15
—
—
3
and V
Typ†
SS
8.0
8.0
8.0
21
31
12
—
7
6
must be capacitively decoupled as close to the
Max
8.08
8.16
8.40
45
24
14
—
11
2
Units
T
MHz
MHz
MHz
kHz
ms
OSC
μs
μs
μs
© 2007 Microchip Technology Inc.
Slowest clock
LFINTOSC/64
V
0°C ≤ T
-40°C ≤ T
-40°C ≤ T
V
V
V
2.5V ≤ V
2.0V ≤ V
DD
DD
DD
DD
= 3.5V, 25°C
= 2.0V, -40°C to +85°C
= 3.0V, -40°C to +85°C
= 5.0V, -40°C to +85°C
A
Conditions
DD
DD
≤ +85°C
A
A
≤ +85°C (Ind.),
≤ +125°C (Ext.)
≤ 5.5V,
≤ 5.5V,