PIC16F684T-E/ST Microchip Technology, PIC16F684T-E/ST Datasheet - Page 21

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PIC16F684T-E/ST

Manufacturer Part Number
PIC16F684T-E/ST
Description
IC PIC MCU FLASH 2KX14 14TSSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F684T-E/ST

Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
12
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
14-TSSOP
For Use With
XLT14SS-1 - SOCKET TRANSITION 14DIP/14SSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Connectivity
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F684T-E/ST
Quantity:
900
1.5.3
1997 Microchip Technology Inc.
Packaging Varieties
Depending on the development phase of your project, one of three package types would be used:
The first is a device with an erasure window. Typically these are found in packages with a ceramic
body. These devices are used for the development phase, since the device’s program memory
can be erased and reprogrammed many times.
The second package type is a low cost plastic package. This package type is used in production
where device cost is to be kept to a minimum.
Lastly, there is the DIE option. A DIE is an unpackaged device that has been tested. DIEs are
used in low cost designs and designs where board space is at a minimum.
quick summary of this.
Table 1-3:
Windowed
Plastic
DIE
Package Type
Typical Package Uses
Typical Usage
Development Mode
Production
Special Applications, such as those which require minimum board space
Section 1. Introduction
Table 1-3
DS31001A-page 1-9
shows a
1

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