PIC16F59-I/PT Microchip Technology, PIC16F59-I/PT Datasheet - Page 81
![IC PIC MCU FLASH 2KX12 44TQFP](/photos/6/82/68251/c04-076_pt_sml.jpg)
PIC16F59-I/PT
Manufacturer Part Number
PIC16F59-I/PT
Description
IC PIC MCU FLASH 2KX12 44TQFP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Specifications of PIC16F59-I/PT
Core Size
8-Bit
Program Memory Size
3KB (2K x 12)
Core Processor
PIC
Speed
20MHz
Peripherals
POR, WDT
Number Of I /o
32
Program Memory Type
FLASH
Ram Size
134 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
44-TQFP, 44-VQFP
Controller Family/series
PIC16F
No. Of I/o's
32
Ram Memory Size
134Byte
Cpu Speed
20MHz
No. Of Timers
1
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
134 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
32
Number Of Timers
1
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
DV164101, DV164120
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164305 - MODULE SKT FOR PM3 44TQFP
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F59-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
© 2007 Microchip Technology Inc.
44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
NOTE 1
e
b
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
β
N
1 2 3
D
D1
Dimension Limits
φ
E1
Units
A2
A1
E1
D1
L
L1
N
D
A
E
α
NOTE 2
e
L
φ
c
b
β
E
A1
A
0.95
0.05
0.45
0.09
0.30
MIN
11°
11°
0°
–
MILLIMETERS
L1
12.00 BSC
12.00 BSC
10.00 BSC
10.00 BSC
0.80 BSC
1.00 REF
NOM
1.00
0.60
0.37
3.5°
12°
12°
44
–
–
–
Microchip Technology Drawing C04-076B
α
MAX
1.20
1.05
0.15
0.75
0.20
0.45
13°
13°
PIC16F5X
7°
A2
DS41213D-page 79