PIC12F675-E/P Microchip Technology, PIC12F675-E/P Datasheet - Page 5
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PIC12F675-E/P
Manufacturer Part Number
PIC12F675-E/P
Description
IC MCU CMOS 1K FLASH W/AD 8-DIP
Manufacturer
Microchip Technology
Series
PIC® 12Fr
Datasheets
1.PIC12F629T-ISN.pdf
(136 pages)
2.PIC12F629T-ISN.pdf
(8 pages)
3.PIC12F629T-ISN.pdf
(24 pages)
4.PIC12F675-ESN.pdf
(132 pages)
Specifications of PIC12F675-E/P
Program Memory Type
FLASH
Program Memory Size
1.75KB (1K x 14)
Package / Case
8-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
POR, WDT
Number Of I /o
5
Eeprom Size
128 x 8
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC12F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
64 B
Interface Type
RS- 232, USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
6
Number Of Timers
8
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 53270-913
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 4 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM163029 - BOARD PICDEM FOR MECHATRONICSAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC12F675-E/P
Manufacturer:
Microchip Technology
Quantity:
1 849
Company:
Part Number:
PIC12F675-E/P
Manufacturer:
TEKMOS
Quantity:
6 238
PIC12F629/675
APPENDIX A:
DOCUMENT
REVISION HISTORY
Rev. A Document (3/2002)
First revision of this document. Revised Table 12.3
Rev. B Document (9/2002)
Added Module 1: “In-Circuit Serial Programming™”,
changes made to the Typical In-Circuit Serial Program-
ming Connection, Figure 9-18.
Rev. C Document (04/02/04)
Removed Table 12.3 and Figure 9-18 due to Data
Sheet revisions.
Added Module 1: “GPIO Port”, changes made to the
TRISIO – GPIO Tri-state Register.
Rev. D Document (11/2004)
Added Module 1: “Data EEPROM Memory” for
PIC12F629/675 silicon.
Rev. E Document (07/2005)
Data Sheet Clarifications/Corrections Section: Added
Module 2: New 4x4 DFN Package added.
Rev. F Document (10/2005)
Data
Sheet
Clarifications/Corrections
Section:
Replaced 8-Lead Plastic Dual Flat No Lead Package
4x4 (DFN).
Rev. G Document (8/2006)
Added Module 2: “Power-on Reset (Rising V
DD
Detect)” for PIC12F629/675 silicon.
Rev. H Document (6/2009)
Updated the document with new format. Deleted
Module 1 and 2 from the Data Sheet Clarification
section. Updated Table 1 and 2. Other minor edits.
© 2009 Microchip Technology Inc.
DS80125H-page 5