PIC16LF1936-E/ML Microchip Technology, PIC16LF1936-E/ML Datasheet - Page 135
![IC PIC MCU FLASH 512KX14 28-QFN](/photos/6/81/68120/150-28-qfn_sml.jpg)
PIC16LF1936-E/ML
Manufacturer Part Number
PIC16LF1936-E/ML
Description
IC PIC MCU FLASH 512KX14 28-QFN
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Datasheets
1.PIC16LF1933-ISS.pdf
(508 pages)
2.PIC16LF1933-ISS.pdf
(46 pages)
3.PIC16LF1934-IML.pdf
(418 pages)
Specifications of PIC16LF1936-E/ML
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Core Processor
PIC
Core Size
8-Bit
Speed
32MHz
Connectivity
I²C, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number Of I /o
25
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC16LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
EUSART/MI2C/SPI
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
25
Number Of Timers
5
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
11-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16LF1936-E/ML
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
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TABLE 11-1:
FIGURE 11-2:
© 2008 Microchip Technology Inc.
Legend:
Note 1:
Clock Source
ADC Clock Period (T
Fosc/16
Fosc/32
Fosc/64
Fosc/2
Fosc/4
Fosc/8
ADC
F
2:
3:
4:
RC
T
Set GO bit
CY
Holding capacitor is disconnected from analog input (typically 100 ns)
Shaded cells are outside of recommended range.
The F
These values violate the minimum required T
For faster conversion times, the selection of another clock source is recommended.
When the device frequency is greater than 1 MHz, the F
performed during Sleep.
- T
AD
Conversion starts
RC
ADCS<2:0>
ADC CLOCK PERIOD (T
T
AD
source has a typical T
000
100
001
101
010
110
x11
1 T
ANALOG-TO-DIGITAL CONVERSION T
AD
)
AD
b9
2 T
1.0-6.0 μs
0.5 μs
62.5ns
125 ns
AD
32 MHz
b8
800 ns
1.0 μs
2.0 μs
3 T
(2)
(2)
(2)
AD
AD
(1,4)
b7
time of 1.6 μs for V
4 T
1.0-6.0 μs
AD
AD
b6
100 ns
200 ns
400 ns
20 MHz
800 ns
1.6 μs
3.2 μs
5 T
) V
On the following cycle:
ADRESH:ADRESL is loaded, GO bit is cleared,
ADIF bit is set, holding capacitor is connected to analog input.
Preliminary
AD
S
AD
(2)
(2)
(2)
b5
. DEVICE OPERATING FREQUENCIES
time.
(1,4)
6 T
DD
AD
1.0-6.0 μs
b4
.
RC
Device Frequency (F
Device Frequency (F
125 ns
250 ns
7 T
0.5 μs
16 MHz
1.0 μs
2.0 μs
4.0 μs
clock source is only recommended if the conversion will be
PIC16F193X/LF193X
AD
b3
(2)
(2)
(2)
AD
8
(1,4)
CYCLES
T
AD
b2
1.0-6.0 μs
9 T
250 ns
500 ns
8.0 μs
8 MHz
1.0 μs
2.0 μs
4.0 μs
AD
b1
OSC
OSC
10
(3)
(2)
(2)
(1,4)
)
)
T
AD
b0
11
1.0-6.0 μs
16.0 μs
500 ns
8.0 μs
4 MHz
1.0 μs
2.0 μs
4.0 μs
(3)
(2)
(3)
(1,4)
DS41364A-page 133
1.0-6.0 μs
16.0 μs
32.0 μs
64.0 μs
8.0 μs
1 MHz
2.0 μs
4.0 μs
(3)
(3)
(3)
(3)
(1,4)
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