PIC16LF1934-E/P Microchip Technology, PIC16LF1934-E/P Datasheet - Page 28
![IC PIC MCU FLASH 256KX7 40-PDIP](/photos/6/61/66192/150-40-dip_sml.jpg)
PIC16LF1934-E/P
Manufacturer Part Number
PIC16LF1934-E/P
Description
IC PIC MCU FLASH 256KX7 40-PDIP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Datasheets
1.PIC16LF1933-ISS.pdf
(508 pages)
2.PIC16LF1933-ISS.pdf
(46 pages)
3.PIC16LF1934-IML.pdf
(418 pages)
Specifications of PIC16LF1934-E/P
Program Memory Type
FLASH
Program Memory Size
7KB (4K x 14)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
32MHz
Connectivity
I²C, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number Of I /o
36
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 14x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC16LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
EUSART/MI2C/SPI
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
36
Number Of Timers
5
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
14-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
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Quantity
Price
Company:
Part Number:
PIC16LF1934-E/P
Manufacturer:
Microchip Technology
Quantity:
135
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PIC16LF1934-E/PT
Manufacturer:
Microchip Technology
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PIC16F193X/LF193X
3.1.1.2
The program memory can be accessed as data by set-
ting bit 7 of the FSRxH register and reading the match-
ing INDFx register. The MOVIW instruction will place the
lower 8 bits of the addressed word in the W register.
Writes to the program memory cannot be performed via
the INDF registers. Instructions that access the pro-
gram memory via the FSR require one extra instruction
cycle to complete. Example 3-2 demonstrates access-
ing the program memory via an FSR.
The HIGH directive will set bit<7> if a label points to a
location in program memory.
EXAMPLE 3-2:
3.2
The data memory is partitioned in 32 memory banks
with 128 bytes in a bank. Each bank consists of
(Figure 3-4):
• 12 core registers
• 20 Special Function Registers (SFR)
• Up to 80 bytes of General Purpose RAM (GPR)
• 16 bytes of common RAM
The active bank is selected by writing the bank number
into the Bank Select Register (BSR). Unimplemented
memory will read as ‘0’. All data memory can be
accessed either directly (via instructions that use the
file registers) or indirectly via the two File Select
Registers
Addressing” for more information.
DS41364D-page 28
constants
my_function
;THE PROGRAM MEMORY IS IN W
retlw DATA0
retlw DATA1
retlw DATA2
retlw DATA3
;… LOTS OF CODE…
movlw
movwf
movlw
movwf
moviw 0[INDF1]
Data Memory Organization
(FSR).
Indirect Read with FSR
LOW constants
FSR1L
HIGH constants
FSR1H
ACCESSING PROGRAM
MEMORY VIA FSR
See
;Index0 data
;Index1 data
Section 3.5
“Indirect
Preliminary
3.2.1
The core registers contain the registers that directly
affect the basic operation of the PIC16F193X/LF193X.
These registers are listed below:
• INDF0
• INDF1
• PCL
• STATUS
• FSR0 Low
• FSR0 High
• FSR1 Low
• FSR1 High
• BSR
• WREG
• PCLATH
• INTCON
Note:
CORE REGISTERS
The core registers are the first 12
addresses of every data memory bank.
2009 Microchip Technology Inc.
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