PIC12C509-04/P Microchip Technology, PIC12C509-04/P Datasheet - Page 8
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PIC12C509-04/P
Manufacturer Part Number
PIC12C509-04/P
Description
IC MCU OTP 1KX12 8DIP
Manufacturer
Microchip Technology
Series
PIC® 12Cr
Datasheets
1.PIC12C508A-04SM.pdf
(113 pages)
2.PIC12C508A-04SM.pdf
(4 pages)
3.PIC12C508-04P.pdf
(12 pages)
Specifications of PIC12C509-04/P
Core Size
8-Bit
Program Memory Size
1.5KB (1K x 12)
Core Processor
PIC
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
5
Program Memory Type
OTP
Ram Size
41 x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
0°C ~ 70°C
Package / Case
8-DIP (0.300", 7.62mm)
Controller Family/series
PIC12
No. Of I/o's
6
Ram Memory Size
41Byte
Cpu Speed
4MHz
No. Of Timers
1
Digital Ic Case Style
DIP
Processor Series
PIC12C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
41 B
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
5
Number Of Timers
8
Operating Supply Voltage
2.5 V to 5.5 V
Maximum Operating Temperature
+ 70 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
DVMCPA, ICE2000
Minimum Operating Temperature
0 C
Package
8PDIP
Device Core
PIC
Family Name
PIC12
Maximum Speed
4 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DVMCPA - KIT DVR BOARD EVAL SYSTEM MXDEV1DVA12XP080 - ADAPTER DEVICE FOR MPLAB-ICEAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Details
PIC12C508/509
8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S)
DS80023C-page 8
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC equivalent: pending
Drawing No. C04-113
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Base Thickness
Overall Length
Molded Package Length
Exposed Pad Length
Overall Width
Molded Package Width
Exposed Pad Width
Lead Width
Lead Length
Tie Bar Width
Mold Draft Angle Top
A1
n
1
α
TOP VIEW
2
E1
E
Dimension Limits
Units
D1
D2
A2
A1
A3
E1
E2
A
E
D
B
R
α
n
p
L
D1
A2
D
A3
MIN
.000
.152
.085
.014
.020
A
.008 REF.
INCHES
.050 BSC
.194 BSC
.184 BSC
.236 BSC
.226 BSC
NOM
EXPOSED
.0004
.033
.026
.158
.091
.016
.024
.014
METAL
PADS
8
MAX
R
.039
.031
.002
.163
.097
.019
.030
12
B
BOTTOM VIEW
MIN
E2
0.00
3.85
2.16
0.35
0.50
2003 Microchip Technology Inc.
MILLIMETERS*
p
0.20 REF.
1.27 BSC
4.92 BSC
4.67 BSC
5.99 BSC
5.74 BSC
NOM
0.85
0.65
0.01
4.00
2.31
0.40
0.60
.356
PIN 1
L
8
ID
D2
MAX
1.00
0.80
0.05
4.15
2.46
0.47
0.75
12