PIC12CE673-04I/P Microchip Technology, PIC12CE673-04I/P Datasheet - Page 11
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PIC12CE673-04I/P
Manufacturer Part Number
PIC12CE673-04I/P
Description
IC MCU OTP 1KX14 A/D&EE 8DIP
Manufacturer
Microchip Technology
Series
PIC® 12Cr
Datasheets
1.PIC16F688T-ISL.pdf
(688 pages)
2.PIC12CE673-10P.pdf
(129 pages)
3.PIC12CE673-10P.pdf
(3 pages)
4.PIC12CE673-10P.pdf
(14 pages)
5.PIC12CE673-10P.pdf
(12 pages)
Specifications of PIC12CE673-04I/P
Core Size
8-Bit
Program Memory Size
1.75KB (1K x 14)
Oscillator Type
Internal
Core Processor
PIC
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
5
Program Memory Type
OTP
Eeprom Size
16 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 4x8b
Operating Temperature
-40°C ~ 85°C
Package / Case
8-DIP (0.300", 7.62mm)
Controller Family/series
PIC12
No. Of I/o's
6
Eeprom Memory Size
16Byte
Ram Memory Size
128Byte
Cpu Speed
4MHz
No.
RoHS Compliant
Processor Series
PIC12C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
5
Number Of Timers
8
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Connectivity
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC12CE673-04I/P
Manufacturer:
Microchip Technology
Quantity:
135
8-Lead Plastic Micro Leadframe Package (MF) 6x5 mm Body (MLF-S)
2001 Microchip Technology Inc.
Pitch
Pad Width
Pad Length
Pad to Solder Mask
*Controlling Parameter
Drawing No. C04-2113
SOLDER
MASK
PACKAGE
p
EDGE
Dimension Limits
Units
M
B
p
L
MIN
.014
.020
.005
INCHES
.050 BSC
NOM
.016
.024
MAX
.019
.030
.006
MIN
M
0.35
0.50
0.13
L
MILLIMETERS*
PIC12C67X
1.27 BSC
NOM
0.40
0.60
B
DS80067C-page 11
M
MAX
0.47
0.75
0.15