PIC16F819T-I/SS Microchip Technology, PIC16F819T-I/SS Datasheet - Page 66
![IC MCU FLASH 2KX14 EEPROM 20SSOP](/photos/6/58/65895/150-20-ssop_sml.jpg)
PIC16F819T-I/SS
Manufacturer Part Number
PIC16F819T-I/SS
Description
IC MCU FLASH 2KX14 EEPROM 20SSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F818-ISO.pdf
(176 pages)
4.PIC16F818-ISO.pdf
(6 pages)
5.PIC16F818-ISO.pdf
(8 pages)
6.PIC16F818-ISO.pdf
(8 pages)
Specifications of PIC16F819T-I/SS
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-SSOP
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
I2C, SPI, SSP
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
16
Number Of Timers
1 x 16 bit
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014
Minimum Operating Temperature
- 40 C
On-chip Adc
5 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F818-ISO PDF datasheet #3
- PIC16F818-ISO PDF datasheet #4
- PIC16F818-ISO PDF datasheet #5
- PIC16F818-ISO PDF datasheet #6
- Current page: 66 of 688
- Download datasheet (3Mb)
PICmicro MID-RANGE MCU FAMILY
3.4
DS31003A-page 3-16
Design Tips
Question 1:
Answer 1:
If the device you are using does not have filtering to the on-chip master clear circuit
ensure that proper external filtering is placed on the MCLR pin to remove narrow pulses. Electri-
cal Specification
Question 2:
Answer 2:
The most common reason for this is that the windowed device (JW) has not had its window cov-
ered. The background light causes the device to power-up in a different state than would typically
be seen in a device where no light is present. In most cases all the General Purpose RAM and
Special Function Registers were not initialized properly.
When my system is subjected to an environment with ESD and EMI, it oper-
ates erratically.
With JW (windowed) devices my system resets and operates properly. With
an OTP device, my system does not operate properly.
parameter 35
specifies the pulse width required to cause a reset.
1997 Microchip Technology Inc.
(Appendix
C),
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