PIC16CE623-20I/P Microchip Technology, PIC16CE623-20I/P Datasheet - Page 100
PIC16CE623-20I/P
Manufacturer Part Number
PIC16CE623-20I/P
Description
IC MCU OTP 512X14 EE COMP 18DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheet
1.PIC16CE623-04P.pdf
(113 pages)
Specifications of PIC16CE623-20I/P
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
13
Program Memory Size
896B (512 x 14)
Program Memory Type
OTP
Eeprom Size
128 x 8
Ram Size
96 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
18-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Data Converters
-
Connectivity
-
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PIC16CE62X
18-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)
DS40182C-page 100
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
JEDEC Equivalent: MS-013
Drawing No. C04-051
B
c
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
p
n
45
Dimension Limits
E1
E
h
Units
A2
A1
E1
A
E
D
B
n
p
h
L
c
2
1
MIN
L
.093
.088
.004
.394
.446
.010
.016
.009
.014
D
.291
0
0
0
INCHES*
NOM
.050
.099
.008
.407
.295
.454
.020
.033
.017
.091
.011
A
18
12
12
A1
4
MAX
.104
.094
.012
.420
.299
.462
.029
.050
.012
.020
15
15
8
MIN
11.33
10.01
2.36
2.24
0.10
7.39
0.25
0.23
0.36
0.41
0
0
0
MILLIMETERS
NOM
1999 Microchip Technology Inc.
10.34
11.53
1.27
2.50
0.20
7.49
0.50
0.84
0.27
0.42
2.31
18
12
12
4
MAX
10.67
11.73
A2
2.64
2.39
0.30
7.59
0.74
1.27
0.30
0.51
15
15
8
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