PIC16C58B-04/SO Microchip Technology, PIC16C58B-04/SO Datasheet - Page 176

IC MCU OTP 2KX12 18SOIC

PIC16C58B-04/SO

Manufacturer Part Number
PIC16C58B-04/SO
Description
IC MCU OTP 2KX12 18SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheets

Specifications of PIC16C58B-04/SO

Core Size
8-Bit
Program Memory Size
3KB (2K x 12)
Core Processor
PIC
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
12
Program Memory Type
OTP
Ram Size
73 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Package / Case
18-SOIC (7.5mm Width)
Controller Family/series
PIC16C
No. Of I/o's
12
Ram Memory Size
73Byte
Cpu Speed
4MHz
No. Of Timers
1
Processor Series
PIC16C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
73 B
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
12
Number Of Timers
8
Operating Supply Voltage
2.5 V to 5.5 V
Maximum Operating Temperature
+ 70 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000
Minimum Operating Temperature
0 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT18SO-1 - SOCKET TRANSITION 18SOIC 300MIL309-1075 - ADAPTER 18-SOIC TO 18-SOIC309-1011 - ADAPTER 18-SOIC TO 18-DIP309-1010 - ADAPTER 18-SOIC TO 18-DIPAC164002 - MODULE SKT PROMATEII 18/28SOIC
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16C58B-04/SO
Manufacturer:
MICROCHIR
Quantity:
35
PIC16C5X
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil (PDIP)
DS30453D-page 174
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
n
eB
E1
E
2
1
Dimension Limits
c
D
§
A1
A
Units
A2
eB
A1
E1
B1
E
D
B
n
p
A
L
c
MIN
1.345
Preliminary
.140
.125
.015
.300
.275
.125
.008
.040
.016
.320
5
5
B
B1
INCHES*
NOM
1.365
.100
.150
.130
.310
.285
.130
.012
.053
.019
.350
28
10
10
MAX
1.385
.135
.325
.295
.135
.015
.065
.160
.022
.430
15
15
MIN
34.16
3.56
3.18
0.38
7.62
6.99
3.18
0.20
1.02
8.13
0.41
5
5
MILLIMETERS
2002 Microchip Technology Inc.
p
NOM
34.67
2.54
3.30
7.87
7.24
3.30
0.29
1.33
0.48
8.89
3.81
28
10
10
A2
L
MAX
35.18
10.92
4.06
3.43
8.26
7.49
3.43
0.38
1.65
0.56
15
15

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