PIC16C56A-04I/SO Microchip Technology, PIC16C56A-04I/SO Datasheet - Page 182
![IC MCU OTP 1KX12 18SOIC](/photos/6/76/67656/150-18-soic_sml.jpg)
PIC16C56A-04I/SO
Manufacturer Part Number
PIC16C56A-04I/SO
Description
IC MCU OTP 1KX12 18SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Specifications of PIC16C56A-04I/SO
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
12
Program Memory Size
1.5KB (1K x 12)
Program Memory Type
OTP
Ram Size
25 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
18-SOIC (7.5mm Width)
For Use With
XLT18SO-1 - SOCKET TRANSITION 18SOIC 300MIL309-1075 - ADAPTER 18-SOIC TO 18-SOIC309-1011 - ADAPTER 18-SOIC TO 18-DIP309-1010 - ADAPTER 18-SOIC TO 18-DIPAC164002 - MODULE SKT PROMATEII 18/28SOIC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Connectivity
-
Other names
PIC16C56A-04I/SOR
PIC16C56A-04I/SOR
PIC16C56A-04I/SOR
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PIC16C5X
18-Lead Ceramic Dual In-line with Window (JW) – 300 mil (CERDIP)
DS30453D-page 180
Number of Pins
Pitch
Top to Seating Plane
Ceramic Package Height
Standoff
Shoulder to Shoulder Width
Ceramic Pkg. Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Window Width
Window Length
* Controlling Parameter
§ Significant Characteristic
JEDEC Equivalent: MO-036
Drawing No. C04-010
W2
n
E1
W1
eB
E
Dimension Limits
§
2
1
Units
W2
eB
W1
D
A2
A1
E1
B1
D
n
p
A
E
L
c
B
c
A1
A
MIN
Preliminary
.170
.155
.015
.300
.285
.880
.125
.008
.050
.016
.345
.130
.190
INCHES*
NOM
.100
.183
.160
.023
.313
.290
.900
.138
.010
.055
.019
.385
.140
.200
18
B
B1
MAX
.195
.165
.030
.325
.295
.920
.150
.060
.425
.150
.210
.012
.021
MIN
22.35
4.32
3.94
0.38
7.62
7.24
3.18
0.20
1.27
8.76
3.30
4.83
0.41
MILLIMETERS
p
NOM
2002 Microchip Technology Inc.
22.86
A2
2.54
4.64
4.06
0.57
7.94
7.37
3.49
0.25
1.40
0.47
9.78
3.56
5.08
18
L
MAX
23.37
10.80
4.95
4.19
0.76
8.26
7.49
0.30
1.52
0.53
5.33
3.81
3.81
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