PIC18LF13K22-I/ML Microchip Technology, PIC18LF13K22-I/ML Datasheet - Page 26

IC PIC MCU FLASH 256KX8 20-QFN

PIC18LF13K22-I/ML

Manufacturer Part Number
PIC18LF13K22-I/ML
Description
IC PIC MCU FLASH 256KX8 20-QFN
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr

Specifications of PIC18LF13K22-I/ML

Program Memory Type
FLASH
Program Memory Size
8KB (4K x 16)
Package / Case
20-VQFN Exposed Pad, 20-HVQFN, 20-SQFN, 20-DHVQFN
Core Processor
PIC
Core Size
8-Bit
Speed
64MHz
Connectivity
I²C, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
17
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
I2C, MSSP, SPI, USART
Maximum Clock Frequency
32 KHz
Number Of Programmable I/os
18
Number Of Timers
4
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 12 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18LF13K22-I/ML
Manufacturer:
CAVIUM
Quantity:
155
PIC18F1XK22/LF1XK22
6.0
The PIC18F1XK22/LF1XK22 devices have several
Configuration Words. These bits can be set or cleared
to select various device configurations. All other mem-
ory areas should be programmed and verified prior to
setting Configuration Words. These bits may be read
out normally, even after read or code protection. See
Table 6-1 for a list of Configuration bits and device IDs
and Table 6-3 for the Configuration bit descriptions.
6.1
A user may store identification information (ID) in eight
ID locations mapped in 200000h:200007h. It is recom-
mended that the Most Significant nibble of each ID be
Fh. In doing so, if the user code inadvertently tries to
execute from the ID space, the ID data will execute as
a NOP.
TABLE 6-1:
DS41357B-page 26
300001h
300002h
300003h
300005h
300006h
300008h
300009h
30000Ah
30000Bh
30000Ch
30000Dh
3FFFFEh
3FFFFFh
Legend:
Note
File Name
1:
2:
CONFIGURATION WORD
ID Locations
DEVID1
DEVID2
CONFIG1H
CONFIG2L
CONFIG2H
CONFIG3H
CONFIG4L
CONFIG5L
CONFIG5H
CONFIG6L
CONFIG6H
CONFIG7L
CONFIG7H
x = unknown, u = unchanged, – = unimplemented. Shaded cells are unimplemented, read as ‘0’.
These bits are only implemented on specific devices. Refer to Section 3.0 “Memory Maps” to determine which bits apply based on
available memory.
DEVID registers are read-only and cannot be programmed by the user.
(2)
(2)
CONFIGURATION BITS AND DEVICE IDs
MCLRE
BKBUG
DEV10
WRTD
DEV2
IESO
Bit 7
CPD
ENHCPU
FCMEN
EBTRB
WRTB
DEV1
DEV9
Bit 6
CPB
PRI_CLK_EN
WRTC
DEV0
DEV8
Bit 5
Advance Information
PLL_EN
WDPS3
BORV1
REV4
DEV7
Bit 4
6.2
The device ID word for the PIC18F1XK22/LF1XK22
devices is located at 3FFFFEh:3FFFFFh. These bits
may be used by the programmer to identify what device
type is being programmed and read out normally, even
after code or read protection. See Table 6-2 for a
complete list of device ID values.
FIGURE 6-1:
HFOFST
WDPS2
FOSC3
BORV0
BBSIZ
REV3
DEV6
Bit 3
Device ID Word
BOREN1
WDPS1
FOSC2
DEV5
REV2
Bit 2
LVP
Set TBLPTR = 3FFFFE
with Post-Increment
with Post-Increment
Read High Byte
Read Low Byte
BOREN0
WDPS0
FOSC1
EBTR1
WRT1
READ DEVICE ID WORD
FLOW
REV1
DEV4
Bit 1
CP1
© 2009 Microchip Technology Inc.
Done
Start
PWRTEN
STVREN
WDTEN
FOSC0
EBTR0
WRT0
REV0
DEV3
Bit 0
CP0
Unprogrammed
See Table 6-2
See Table 6-2
0010 0111
---1 1111
---1 1111
1--- 1---
10-- 01-1
---- --11
11-- ----
---- --11
111- ----
---- --11
-1-- ----
Default/
Value

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