PIC16C715-04/SS Microchip Technology, PIC16C715-04/SS Datasheet - Page 158

• Manufacturer Part Number: PIC16C715-04/SS
• Description: IC MCU OTP 2KX14 A/D 20SSOP
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C715-04/SS

• Core Size: 8-Bit
• Program Memory Size: 3.5KB (2K x 14)
• Core Processor: PIC
• Speed: 4MHz
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 13
• Program Memory Type: OTP
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 4x8b
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 20-SSOP
• Controller Family/series: PIC16C
• No. Of I/o's: 13
• Ram Memory Size: 128Byte
• Cpu Speed: 4MHz
• No. Of Timers: 1
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 309-1016 - ADAPTER 20-SSOP TO 18-DIP
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

PIC16C71X
17.4
Note 1: Dimensions D1 and E1 do not include mold protrusion. Allowable mold protrusion is 0.25m/m (0.010”) per
DS30272A-page 158
Symbol
2: Dimension “b” does not include Dambar protrusion, allowable Dambar protrusion shall be 0.08m/m
3: This outline conforms to JEDEC MS-026.
CP
A1
C
D
H
N
A
B
E
e
L
20-Lead Plastic Surface Mount (SSOP - 209 mil Body 5.30 mm) (SS)
side. D1 and E1 dimensions including mold mismatch.
(0.003”)max.
Index
area
CP
E
1 2 3
N
1.730
0.050
0.250
0.130
7.070
5.200
0.650
7.650
0.550
Min
20
0
-
e
D
Millimeters
1.990
0.210
0.380
0.220
7.330
5.380
0.650
7.900
0.950
0.102
Max
B
20
8
Package Group: Plastic SSOP
A1
H
A
Reference
Notes
Base plane
Seating plane
0.068
0.002
0.010
0.005
0.278
0.205
0.026
0.301
0.022
L
Min
20
0
-
Inches
1997 Microchip Technology Inc.
0.078
0.008
0.015
0.009
0.289
0.212
0.026
0.311
0.037
0.004
Max
20
8
Reference
Notes
C