PIC16LF1946-I/MR Microchip Technology, PIC16LF1946-I/MR Datasheet - Page 24

• Manufacturer Part Number: PIC16LF1946-I/MR
• Description: MCU 8BIT 14KB FLASH 3.6V 64QFN
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 16Fr

Specifications of PIC16LF1946-I/MR

• Core Size: 8-Bit
• Program Memory Size: 14KB (8K x 14)
• Core Processor: PIC
• Speed: 32MHz
• Connectivity: I²C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, WDT
• Number Of I /o: 54
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 17x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-VQFN Exposed Pad, 64-HVQFN, 64-SQFN, 64-DHVQFN
• Controller Family/series: PIC16LF
• No. Of I/o's: 54
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 512Byte
• Cpu Speed: 32MHz
• No. Of Timers: 5
• Processor Series: PIC16LF
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: MI2C, SPI, EUSART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 54
• Number Of Timers: 5
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 17 Channel
• On-chip Dac: 5 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PIC16F193X/LF193X/PIC16F194X/LF194X/
4.3.9
A Load Configuration, Load Data for Program Memory
or Load Data for Data Memory command must be given
before every Begin Programming command. Program-
ming of the addressed memory will begin after this
command is received. To complete the programming,
the End Externally Timed Programming command
must be sent in the specified time window defined by
T
EEPROM, therefore, the device should be erased prior
to executing this command (see
FIGURE 4-9:
4.3.10
This command is required after a Begin Externally
Timed
command must be sent within the time window
specified by T
Programming command is sent.
After sending the End Externally Timed Programming
command, an additional delay (T
sending the next command. This delay is longer than
the delay ordinarily required between other commands
(see
FIGURE 4-10:
DS41397B-page 24
PEXT
Figure
. No internal erase is performed for the data
Programming
ICSPCLK
ICSPDAT
ICSPDAT
BEGIN EXTERNALLY TIMED
PROGRAMMING
END EXTERNALLY TIMED
PROGRAMMING
ICSPCLK
4-10).
PEXT
after the Begin Externally Timed
BEGIN EXTERNALLY TIMED PROGRAMMING
END EXTERNALLY TIMED PROGRAMMING
command
1
0
1
0
Figure
DIS
) is required before
2
is
2
1
0
4-9).
given.
3
3
0
0
This
4
4
1
1
5
5
1
1
Externally timed writes are not supported for
Configuration and Calibration bits. Any externally timed
write to the Configuration or Calibration Word will have
no effect on the targeted word.
6
6
X
X
T
PEXT
T
End Externally Timed Programming
DIS
Command
1
0
1
2
 2010 Microchip Technology Inc.
Next Command
X
1
2
3
0
X
3
X