PIC18F26K20-E/ML Microchip Technology, PIC18F26K20-E/ML Datasheet - Page 5
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PIC18F26K20-E/ML
Manufacturer Part Number
PIC18F26K20-E/ML
Description
IC PIC MCU FLASH 32KX16 28QFN
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.PIC18F25K20T-ISS.pdf
(42 pages)
2.PIC18F25K20T-ISS.pdf
(456 pages)
3.PIC18F26K20-ISS.pdf
(6 pages)
4.PIC18F26K20-ISS.pdf
(10 pages)
5.PIC18F26K20-EML.pdf
(430 pages)
Specifications of PIC18F26K20-E/ML
Core Size
8-Bit
Program Memory Size
64KB (32K x 16)
Core Processor
PIC
Speed
48MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
24
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Controller Family/series
PIC18
No. Of I/o's
25
Eeprom Memory Size
1024Byte
Ram Memory Size
3.84375KB
Cpu Speed
64MHz
No. Of Timers
4
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3936 B
Interface Type
CCP, ECCP, EUSART, I2C, MSSP, SPI
Maximum Clock Frequency
64 MHz
Number Of Programmable I/os
25
Number Of Timers
4
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 11 Channel
Package
28QFN EP
Device Core
PIC
Family Name
PIC18
Maximum Speed
64 MHz
Operating Supply Voltage
2.5|3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164112 - VOLTAGE LIMITER MPLAB ICD2 VPPAC164322 - MODULE SOCKET MPLAB PM3 28/44QFN
Lead Free Status / Rohs Status
Details
12. Module: ADC
2010 Microchip Technology Inc.
• The potential for failures increases over the life
• The potential for failures is highest at low V
1. Restrict the input voltage to less than 1/2 of the
2. Use manual acquisition time (ACQT<2:0> =
After extended stress the Most Significant bit
(MSb) of the ADC conversion result can become
stuck at ‘0’. Conversions resulting in code 511 or
less are still accurate, but conversions that should
result in codes greater than 511 are instead pinned
at 511.
The potential for failures is a function of several
factors:
Work around
ADC voltage reference so that the expected
result is always a code less than or equal to 511.
000) and put the part to Sleep after each
conversion.
Affected Silicon Revisions
of the part. No failures have ever been seen for
accelerated stress estimated to be equivalent
to 34 years at room temperature. The failure
rate after accelerated stress estimated to be
equivalent to 146 years at room temperature
can be as high as 10% for V
to failure will decrease as the operating
temperature increases.
and decreases as V
B2
X
B3
X
B5
DD
increases.
DD
= 1.8V. The time
DD
13. Module: Interrupt-on-Change
1.
2.
PIC18F26K20/46K20
When any interrupt-on-change is enabled and the
corresponding input is high, then waking from
Sleep by a source other than interrupt-on-change
may cause the RBIF interrupt flag bit to become
set improperly.
Work around
Use the INTx interrupts in lieu of interrupt-on-
change
Or
Store the state of the PORTB inputs before
entering Sleep. Upon waking, if an RBIF is
detected, then compare the PORTB levels with
those stored. If they are the same, then clear
and ignore the RBIF interrupt.
Affected Silicon Revisions
B2
X
B3
X
B5
X
DS80404E-page 5