PIC18LF2221-I/SO Microchip Technology, PIC18LF2221-I/SO Datasheet - Page 14
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PIC18LF2221-I/SO
Manufacturer Part Number
PIC18LF2221-I/SO
Description
IC PIC MCU FLASH 2KX16 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC18F2221-ISO.pdf
(402 pages)
2.PIC18F2221-ISO.pdf
(8 pages)
3.PIC18F2221-ISO.pdf
(30 pages)
4.PIC18F2221-ISO.pdf
(46 pages)
5.PIC18LF2221-IML.pdf
(394 pages)
6.PIC18F2321-IML.pdf
(396 pages)
Specifications of PIC18LF2221-I/SO
Core Size
8-Bit
Program Memory Size
4KB (2K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Controller Family/series
PIC18
No. Of I/o's
25
Eeprom Memory Size
256Byte
Ram Memory Size
512Byte
Cpu Speed
40MHz
No. Of Timers
4
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
PIC18F2221/2321/4221/4321
26.2
DS80310G-page 14
PIC18LF2221/2321/4221/4321
PIC18F2221/2321/4221/4321
Legend:
Note 1:
Param
No.
(Industrial)
(Industrial, Extended)
2:
3:
4:
5:
DC Characteristics:
Power-Down Current (I
Shading of rows is to assist in readability of the table.
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all I
Low-power, Timer1 oscillator is selected unless otherwise indicated, where LPT1OSC (CONFIG3H<2>) =
BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less
than the sum of both specifications.
When operation below -10°C is expected, use T1OSC high-power mode where LPT1OSC (CONFIG3H<2>) =
Extended devices only
PIC18LF2X21/4X21
PIC18LF2X21/4X21
Device
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
MCLR = V
All devices
DD
; WDT enabled/disabled as specified.
PD
DD
)
(1)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Power-Down and Supply Current
PIC18F2221/2321/4221/4321 (Industrial)
PIC18LF2221/2321/4221/4321 (Industrial)
Typ
measurements in active operation mode are:
7.5
0.5
0.5
0.5
0.6
0.6
0.6
0.9
0.9
0.9
Max
0.7
0.7
1.7
0.9
0.9
1.9
2.0
2.0
6.5
70
Units
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
-40°C ≤ T
-40°C ≤ T
-40°C ≤ T
+125°C
+25°C
+85°C
+25°C
+85°C
+25°C
+85°C
-40°C
-40°C
-40°C
A
A
A
≤ +85°C for industrial
≤ +85°C for industrial
≤ +125°C for extended
Conditions
© 2008 Microchip Technology Inc.
DD
or V
SS
DD
and all features that
(Sleep mode)
(Sleep mode)
(Sleep mode)
or V
V
V
V
DD
DD
DD
SS
= 2.0V
= 3.0V
= 5.0V
;
1
.
0
.