PIC16C56-XTI/SO Microchip Technology, PIC16C56-XTI/SO Datasheet - Page 72
![IC MCU OTP 1KX12 18SOIC](/photos/6/76/67656/150-18-soic_sml.jpg)
PIC16C56-XTI/SO
Manufacturer Part Number
PIC16C56-XTI/SO
Description
IC MCU OTP 1KX12 18SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheet
1.PIC16LC58B-04P.pdf
(194 pages)
Specifications of PIC16C56-XTI/SO
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
12
Program Memory Size
1.5KB (1K x 12)
Program Memory Type
OTP
Ram Size
25 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 6.25 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
18-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Connectivity
-
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PIC16C5X
12.3
DS30453D-page 70
PIC16C54/55/56/57-RCE, XTE, 10E, HSE, LPE
D001
D002
D003
D004
D010
D020
Note 1: This is the limit to which V
Param
(Extended)
No.
* These parameters are characterized but not tested.
† Data in “Typ” column is based on characterization results at 25 C. This data is for design guidance only and is
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
3: Does not include current through R
DC Characteristics: PIC16C54/55/56/57-RCE, XTE, 10E, HSE, LPE (Extended)
Symbol
not tested.
V
S
loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on
the current consumption.
I
V
V
R
b) For standby current measurements, the conditions are the same, except that the device is in SLEEP
a) The test conditions for all I
I
I
POR
VDD
DD
PD
DD
DR
= V
mode. The power-down current in SLEEP mode does not depend on the oscillator type.
wave, from rail-to-rail; all I/O pins tristated, pulled to V
enabled/disabled as specified.
DD
Supply Voltage
PIC16C5X-RCE
PIC16C5X-XTE
PIC16C5X-10E
PIC16C5X-HSE
PIC16C5X-LPE
RAM Data Retention Voltage
V
Power-on Reset
V
Power-on Reset
Supply Current
PIC16C5X-RCE
PIC16C5X-XTE
PIC16C5X-10E
PIC16C5X-HSE
PIC16C5X-HSE
PIC16C5X-LPE
Power-down Current
/2R
DD
DD
EXT
Start Voltage to ensure
Rise Rate to ensure
Characteristic/Device
(mA) with R
(3)
(2)
DD
EXT
can be lowered in SLEEP mode without losing RAM data.
(2)
DD
in k .
measurements in active Operation mode are: OSC1 = external square
EXT
(1)
. The current through the resistor can be estimated by the formula:
Preliminary
Standard Operating Conditions (unless otherwise specified)
Operating Temperature –40°C
0.05*
3.25
3.25
Min
4.5
4.5
2.5
—
—
—
—
—
—
—
—
—
—
Typ†
1.5*
V
1.8
1.8
4.8
4.8
9.0
5.0
0.8
19
—
—
—
—
—
—
SS
Max
6.0
6.0
5.5
5.5
6.0
3.3
3.3
—
—
—
10
10
20
55
22
18
SS
, T0CKI = V
Units
V/ms
mA
mA
mA
mA
mA
V
V
V
V
V
V
V
A
A
A
T
Device in SLEEP mode
See Section 5.1 for details on
Power-on Reset
See Section 5.1 for details on
Power-on Reset
F
F
F
F
F
F
WDT disabled
V
V
A
OSC
OSC
OSC
OSC
OSC
OSC
DD
DD
2002 Microchip Technology Inc.
DD
+125°C for extended
, MCLR = V
= 3.25V, WDT enabled
= 3.25V, WDT disabled
= 32 kHz, V
= 4 MHz, V
= 4 MHz, V
= 10 MHz, V
= 10 MHz, V
= 16 MHz, V
Conditions
DD
DD
DD
DD
DD
DD
DD
= 5.5V
= 5.5V
; WDT
= 3.25V,
= 5.5V
= 5.5V
= 5.5V
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