PIC18LF2455T-I/SO Microchip Technology, PIC18LF2455T-I/SO Datasheet - Page 422

• Manufacturer Part Number: PIC18LF2455T-I/SO
• Description: IC PIC MCU FLASH 12KX16 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18LF2455T-I/SO

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I²C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 24
• Program Memory Size: 24KB (12K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Processor Series: PIC18LF
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 2048 B
• Interface Type: SPI, I2C, EAUSART
• Maximum Clock Frequency: 48 MHz
• Number Of Programmable I/os: 24
• Number Of Timers: 1 x 8
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163014, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 10 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PIC18F2455/2550/4455/4550
APPENDIX C:
This appendix discusses the considerations for
converting from previous versions of a device to the
ones listed in this data sheet. Typically, these changes
are due to the differences in the process technology
used. An example of this type of conversion is from a
PIC16C74A to a PIC16C74B.
DS39632E-page 420
Not Applicable
CONVERSION
CONSIDERATIONS
APPENDIX D:
This section discusses how to migrate from a Baseline
device (i.e., PIC16C5X) to an Enhanced MCU device
(i.e., PIC18FXXX).
The following are the list of modifications over the
PIC16C5X microcontroller family:
Not Currently Available
MIGRATION FROM
BASELINE TO
ENHANCED DEVICES
© 2009 Microchip Technology Inc.