PIC16C56-10I/P Microchip Technology, PIC16C56-10I/P Datasheet - Page 176
![IC MCU OTP 1KX12 18DIP](/photos/6/76/67657/18-dip_300mil__sml.jpg)
PIC16C56-10I/P
Manufacturer Part Number
PIC16C56-10I/P
Description
IC MCU OTP 1KX12 18DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheet
1.PIC16LC58B-04P.pdf
(194 pages)
Specifications of PIC16C56-10I/P
Core Processor
PIC
Core Size
8-Bit
Speed
10MHz
Peripherals
POR, WDT
Number Of I /o
12
Program Memory Size
1.5KB (1K x 12)
Program Memory Type
OTP
Ram Size
25 x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
18-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Connectivity
-
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PIC16C5X
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil (PDIP)
DS30453D-page 174
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
n
eB
E1
E
2
1
Dimension Limits
c
D
§
A1
A
Units
A2
eB
A1
E1
B1
E
D
B
n
p
A
L
c
MIN
1.345
Preliminary
.140
.125
.015
.300
.275
.125
.008
.040
.016
.320
5
5
B
B1
INCHES*
NOM
1.365
.100
.150
.130
.310
.285
.130
.012
.053
.019
.350
28
10
10
MAX
1.385
.135
.325
.295
.135
.015
.065
.160
.022
.430
15
15
MIN
34.16
3.56
3.18
0.38
7.62
6.99
3.18
0.20
1.02
8.13
0.41
5
5
MILLIMETERS
2002 Microchip Technology Inc.
p
NOM
34.67
2.54
3.30
7.87
7.24
3.30
0.29
1.33
0.48
8.89
3.81
28
10
10
A2
L
MAX
35.18
10.92
4.06
3.43
8.26
7.49
3.43
0.38
1.65
0.56
15
15
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